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| Фото | Номер производителя | Наличие | Количество | Технический лист | Серия | Упаковка | Состояние продукта | Тип | Упаковка охлаждаемая | Способ крепления | Форма | Длина | Ширина | Диаметр | Высота ребра | Рассеивание мощности при повышении температуры | Тепловое сопротивление при принудительном потоке воздуха | Тепловое сопротивление при естественном | Материал | Отделка материала |
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ATS-LQHS-74025-C1-R0LIQUID ASSISTED FANSINK ASMBLY, |
8 |
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Технический лист |
fanSINK™ | Box | Active | Top Mount | BGA | Push Pin, Thermal Material | Square, Pin Fins | 2.913" (74.00mm) | 2.913" (74.00mm) | - | 1.016" (25.80mm) | - | - | 0.13°C/W | - | Black Anodized |
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ATS-LQHS-84030-C1-R0LIQUID ASSISTED FANSINK ASMBLY, |
10 |
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Технический лист |
fanSINK™ | Box | Active | Top Mount | BGA | Push Pin, Thermal Material | Square, Pin Fins | 3.307" (84.00mm) | 3.307" (84.00mm) | - | 1.213" (30.80mm) | - | - | - | - | Black Anodized |
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ATS-LQHS-84025-C1-R0LIQUID ASSISTED FANSINK ASMBLY, |
10 |
|
Технический лист |
fanSINK™ | Box | Active | Top Mount | BGA | Push Pin, Thermal Material | Square, Pin Fins | 3.307" (84.00mm) | 3.307" (84.00mm) | - | 1.016" (25.80mm) | - | - | - | - | Black Anodized |
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ATS-UC-CRYQL-100ULTRA COOL HEAT SINK CRYOQOOL, C |
25 |
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Технический лист |
- | Box | Active | Top Mount | Intel LGA2011 & LGA2066 & LGA1366 CPU Cooler | Push Pin, Thermal Material | Rectangular, Fins | 5.394" (137.00mm) | 3.843" (97.60mm) | - | 1.882" (47.80mm) | - | - | - | Copper | - |
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ATS-UC-ARGUS-D200ULTRA COOL DUALFLOW HEAT SINK, A |
23 |
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Технический лист |
- | Box | Active | Top Mount | Intel LGA2011 & LGA2066 CPU Cooler | Push Pin, Thermal Material | Square, Fins | 4.764" (121.00mm) | 4.764" (121.00mm) | - | 2.520" (64.00mm) | - | - | - | Copper | Nickel |
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SAR-TR10TRANSISTOR HEATSINK TO-220 |
440 |
|
Технический лист |
- | Bulk | Active | Board Level | - | PC Pin | Rectangular, Fins | 1.122" (28.50mm) | 1.181" (30.00mm) | - | 0.945" (24.00mm) | - | - | - | Aluminum | Black Anodized |
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833202B03700HEATSINK STAMP 10X21.2X19MM |
347 |
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Технический лист |
- | Bulk | Obsolete | Board Level, Vertical | TO-220 | Bolt On and PC Pin | Rectangular, Fins | 0.750" (19.05mm) | 0.835" (21.21mm) | - | 0.394" (10.00mm) | 3.0W @ 60°C | 12.00°C/W @ 200 LFM | - | Aluminum | Black Anodized |
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HSE-B18254-035H-00HEAT SINK, EXTRUSION, TO-218, 25 |
0 |
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Технический лист |
HSE | Bulk | Active | Board Level, Vertical | TO-218 | Clip and PC Pin | Rectangular, Angled Fins | 1.000" (25.40mm) | 1.638" (41.60mm) | - | 0.984" (25.00mm) | 10.0W @ 75°C | 4.03°C/W @ 200 LFM | 7.50°C/W | Aluminum Alloy | Black Anodized |
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833202B04800HEATSINK STAMP 10X21.2X19MM |
933 |
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Технический лист |
- | Bulk | Obsolete | Board Level, Vertical | TO-220 | Bolt On and PC Pin | Rectangular, Fins | 0.750" (19.05mm) | 0.835" (21.21mm) | - | 0.394" (10.00mm) | 3.0W @ 60°C | 12.00°C/W @ 200 LFM | - | Aluminum | Black Anodized |
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XL25-20-20-2.0XL25 CERAMIC BOARD 20X20X2MM |
345 |
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Технический лист |
XL-25 | Box | Obsolete | Heat Spreader | Assorted (BGA, LGA, CPU, ASIC...) | - | Square | 0.787" (20.00mm) | 0.787" (20.00mm) | - | 0.079" (2.00mm) | - | - | - | Ceramic | - |
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SAR57ASX30MMEXTRUDED HEATSINK 57MM X 30MM |
495 |
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Технический лист |
57AS | Box | Active | Board Level | TO-220 | PC Pin | Rectangular, Fins | 1.181" (30.00mm) | 0.602" (15.30mm) | - | 0.472" (12.00mm) | - | - | - | Aluminum | Black Anodized |
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XL25-35-35-10CERAMIC HEAT SPREADER 35X35MM GR |
40 |
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Технический лист |
XL-25 | Tray | Obsolete | Heat Spreader | Assorted (BGA, LGA, CPU, ASIC...) | - | Square | 1.378" (35.00mm) | 1.378" (35.00mm) | - | 0.394" (10.00mm) | - | - | - | Ceramic | - |
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SAR59ASX30MMEXTRUDED HEATSINK 59MM X 30MM |
394 |
|
Технический лист |
59AS | Box | Active | Board Level | TO-220 | PC Pin | Rectangular, Fins | 1.181" (30.00mm) | 0.933" (23.70mm) | - | 0.650" (16.51mm) | - | - | - | Aluminum | Black Anodized |
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SAR59ASX35MMEXTRUDED HEATSINK 59MM X 35MM |
500 |
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Технический лист |
59AS | Box | Active | Board Level | TO-220 | PC Pin | Rectangular, Fins | 1.378" (35.00mm) | 0.933" (23.70mm) | - | 0.650" (16.51mm) | - | - | - | Aluminum | Black Anodized |
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XL25-40-40-10CERAMIC HEAT SPREADER 40X40MM GR |
66 |
|
Технический лист |
XL-25 | Tray | Obsolete | Heat Spreader | Assorted (BGA, LGA, CPU, ASIC...) | - | Square | 1.575" (40.00mm) | 1.575" (40.00mm) | - | 0.394" (10.00mm) | - | - | - | Ceramic | - |
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XL25-40-40-10-T1-0.25CERAMIC HEAT SPREADER 40X40MM GR |
41 |
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Технический лист |
XL-25 | Tray | Obsolete | Heat Spreader | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | Square | 1.575" (40.00mm) | 1.575" (40.00mm) | - | 0.394" (10.00mm) | - | - | - | Ceramic | - |
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XL25-40-40-3.0XL25 CERAMIC BOARD 40X40X3MM |
78 |
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Технический лист |
XL-25 | Box | Obsolete | Heat Spreader | Assorted (BGA, LGA, CPU, ASIC...) | - | Square | 1.575" (40.00mm) | 1.575" (40.00mm) | - | 0.118" (3.00mm) | - | - | - | Ceramic | - |
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XL25-50-50-10CERAMIC HEAT SPREADER 50X50MM GR |
27 |
|
Технический лист |
XL-25 | Tray | Obsolete | Heat Spreader | Assorted (BGA, LGA, CPU, ASIC...) | - | Square | 1.969" (50.00mm) | 1.969" (50.00mm) | - | 0.394" (10.00mm) | - | - | - | Ceramic | - |
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695-1BHEATSINK FOR STUD MT DIODE BLACK |
81 |
|
Технический лист |
695 | Bulk | Obsolete | Board Level | Stud Mounted Diode | Bolt On | - | - | - | 0.625" (15.88mm) ID, 1.330" (33.78mm) OD | 0.530" (13.46mm) | 4.0W @ 72°C | 5.20°C/W @ 400 LFM | 18.00°C/W | Aluminum | Black Anodized |
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XL25-50-50-10-T1-0.25CERAMIC HEAT SPREADER 50X50MM GR |
35 |
|
Технический лист |
XL-25 | Tray | Obsolete | Heat Spreader | Assorted (BGA, LGA, CPU, ASIC...) | Thermal Tape, Adhesive (Included) | Square | 1.969" (50.00mm) | 1.969" (50.00mm) | - | 0.394" (10.00mm) | - | - | - | Ceramic | - |
