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| Фото | Номер производителя | Наличие | Количество | Технический лист | Серия | Упаковка | Состояние продукта | Тип | Упаковка охлаждаемая | Способ крепления | Форма | Длина | Ширина | Диаметр | Высота ребра | Рассеивание мощности при повышении температуры | Тепловое сопротивление при принудительном потоке воздуха | Тепловое сопротивление при естественном | Материал | Отделка материала |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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260-6SH5EHEAT SINK FOR TO-5 PKG |
36 |
|
Технический лист |
260 | Bulk | Active | Board Level | TO-5 | Bolt On | Cylindrical | 0.557" (14.15mm) | 0.370" (9.40mm) | 0.290" (7.37mm) ID | - | - | - | 14.00°C/W | - | Black Ebonol |
|
ATS-X50325G-C1-R0SUPERGRIP HEATSINK 32X32X12.5MM |
125 |
|
Технический лист |
maxiFLOW, superGRIP™ | Bulk | Active | Top Mount | BGA | Clip, Thermal Material | Square, Angled Fins | 1.260" (32.00mm) | 1.260" (32.00mm) | - | 0.492" (12.50mm) | - | 3.50°C/W @ 200 LFM | - | Aluminum | Blue Anodized |
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|
258.5X.25X.34 HEATSINK FOR DIODE |
98 |
|
- |
258 | Bulk | Active | Board Level | Stud Mounted Diode | Type 120 Compound | Rectangular | 0.250" (6.35mm) | 0.500" (12.70mm) | - | 0.340" (8.64mm) | - | - | 12.00°C/W | Aluminum | - |
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ATS-X53300P-C1-R0SUPERGRIP HEATSINK 30X30X17.5MM |
124 |
|
Технический лист |
superGRIP™ | Bulk | Active | Top Mount | BGA | Clip, Thermal Material | Square, Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | - | 0.689" (17.50mm) | - | 4.80°C/W @ 200 LFM | - | Aluminum | Blue Anodized |
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ATS-NVA-3353-C1-R0ACTIVE HEATSINK 63X40X8MM NVIDIA |
73 |
|
Технический лист |
- | Box | Active | Top Mount | Nvidia Jetson TX2 NX Module | Bolt On, Thermal Material | Rectangular, Fins | 2.480" (63.00mm) | 1.575" (40.00mm) | - | 0.315" (8.00mm) | - | - | 1.60°C/W | Aluminum | Black Anodized |
|
ATS-X53330P-C1-R0SUPERGRIP HEATSINK 33X33X17.5MM |
125 |
|
Технический лист |
superGRIP™ | Bulk | Active | Top Mount | BGA | Clip, Thermal Material | Square, Fins | 1.299" (32.99mm) | 1.299" (32.99mm) | - | 0.689" (17.50mm) | - | 4.10°C/W @ 200 LFM | - | Aluminum | Blue Anodized |
|
|
ATS-NVA-2780-C1-R0ACTIVE HEATSINK 60X40X8MM NVIDIA |
84 |
|
Технический лист |
- | Box | Active | Top Mount | Nvidia Jetson Nano | Bolt On, Thermal Material | Rectangular, Fins | 2.362" (60.00mm) | 1.575" (40.00mm) | - | 0.315" (8.00mm) | - | - | 1.60°C/W | Aluminum | Black Anodized |
|
ATS-56013-C3-R0HEAT SINK 42MM X 42MM X 16MM |
27 |
|
Технический лист |
maxiFLOW | Bulk | Active | Top Mount | ASIC | Thermal Tape, Adhesive (Included) | Square, Angled Fins | 1.654" (42.00mm) | 1.654" (42.00mm) | - | 0.630" (16.00mm) | - | 2.20°C/W @ 200 LFM | - | Aluminum | Gold Anodized |
|
ATS-X50300P-C1-R0SUPERGRIP HEATSINK 30X30X17.5MM |
125 |
|
Технический лист |
maxiFLOW, superGRIP™ | Bulk | Active | Top Mount | BGA | Clip, Thermal Material | Square, Angled Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | - | 0.689" (17.50mm) | - | 3.40°C/W @ 200 LFM | - | Aluminum | Blue Anodized |
|
ATS-X50325P-C1-R0SUPERGRIP HEATSINK 32X32X17.5MM |
125 |
|
Технический лист |
maxiFLOW, superGRIP™ | Bulk | Active | Top Mount | BGA | Clip, Thermal Material | Square, Angled Fins | 1.260" (32.00mm) | 1.260" (32.00mm) | - | 0.689" (17.50mm) | - | 2.70°C/W @ 200 LFM | - | Aluminum | Blue Anodized |
|
ATS-X50330P-C1-R0SUPERGRIP HEATSINK 33X33X17.5MM |
120 |
|
Технический лист |
maxiFLOW, superGRIP™ | Bulk | Active | Top Mount | BGA | Clip, Thermal Material | Square, Angled Fins | 1.299" (32.99mm) | 1.299" (32.99mm) | - | 0.689" (17.50mm) | - | 2.70°C/W @ 200 LFM | - | Aluminum | Blue Anodized |
|
|
SM321-22001YAMD 1U 92.4X118.X25MM |
23 |
|
Технический лист |
- | Box | Active | Top Mount | AMD GENOA 9004 1U CPU Cooler | Push Pin | Rectangular, Fins | 4.646" (118.00mm) | 3.638" (92.40mm) | - | 0.984" (25.00mm) | - | - | - | Aluminum, Copper | Nickel |
|
|
303NHEATSINK COMPACT |
49 |
|
Технический лист |
303 | Bulk | Active | Board Level, Vertical | Stud Mounted Semiconductor Cases | Press Fit | Rectangular, Fins | 2.000" (50.80mm) | 3.000" (76.20mm) | - | 2.000" (50.80mm) | 15.0W @ 37°C | 1.30°C/W @ 250 LFM | - | Aluminum Alloy | Black Anodized |
|
|
441KHEATSINK HIGH PWR RECT/DIODES |
74 |
|
Технический лист |
441 | Bulk | Active | Board Level, Extrusion | Stud Mounted Diode | Press Fit | Rectangular, Fins | 5.500" (139.70mm) | 4.500" (114.30mm) | - | 4.500" (114.30mm) | 50.0W @ 34°C | 0.30°C/W @ 250 LFM | - | Aluminum | Black Anodized |
|
HSF-55-24-Y-FFANSINK 12VDC 55X55X24.1MM |
46 |
|
Технический лист |
HSF | Bulk | Active | Top Mount | BGA | Clip | Square, Fins | 2.165" (55.00mm) | 2.165" (55.00mm) | - | 0.949" (24.10mm) | - | - | 1.00°C/W | Aluminum Alloy | Black Anodized |
|
|
HSF-48-25-Y-FFANSINK 5VDC 47.5X47.5X24.5MM |
40 |
|
Технический лист |
HSF | Bulk | Active | Top Mount | BGA | Clip | Square, Fins | 1.870" (47.50mm) | 1.870" (47.50mm) | - | 0.965" (24.50mm) | - | - | 0.98°C/W | Aluminum Alloy | Black Anodized |
|
|
HSF-55-24-B-FFANSINK 12VDC 55X55X24.1MM |
98 |
|
Технический лист |
HSF | Bulk | Active | Top Mount | BGA | Clip | Square, Fins | 2.165" (55.00mm) | 2.165" (55.00mm) | - | 1.555" (39.50mm) | - | - | 1.00°C/W | Aluminum Alloy | Black Anodized |
|
|
HSF-48-40-Y-FFANSINK 5VDC 47.5X47.5X39.5MM |
84 |
|
Технический лист |
HSF | Bulk | Active | Top Mount | BGA | Clip | Square, Fins | 1.870" (47.50mm) | 1.870" (47.50mm) | - | 1.555" (39.50mm) | - | - | 0.72°C/W | Aluminum Alloy | Black Anodized |
|
|
HSF-48-40-B-FFANSINK 5VDC 47.5X47.5X39.5MM |
88 |
|
Технический лист |
HSF | Bulk | Active | Top Mount | BGA | Clip | Square, Fins | 1.870" (47.50mm) | 1.870" (47.50mm) | - | 1.358" (34.50mm) | - | - | 0.72°C/W | Aluminum Alloy | Black Anodized |
|
|
ATS-LQHS-74030-C1-R0LIQUID ASSISTED FANSINK ASMBLY, |
7 |
|
Технический лист |
fanSINK™ | Box | Active | Top Mount | BGA | Push Pin, Thermal Material | Square, Pin Fins | 2.913" (74.00mm) | 2.913" (74.00mm) | - | 1.213" (30.80mm) | - | - | 0.13°C/W | - | Black Anodized |
