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| Фото | Номер производителя | Наличие | Количество | Технический лист | Серия | Упаковка | Состояние продукта | Тип | Состав | Диаметр | Точка плавления | Тип флюса | Сечение провода | Тип сетки | Процесс | Форма | Срок хранения | Начало срока годности | Температура хранения/охлаждения |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
WS991LT35T4THERMALLY STABLE SOLDER PASTE WS |
6 |
|
Технический лист |
CHIPQUIK® | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | Water Soluble | - | 4 | - | Syringe, 1.23 oz (34.869g) | 12 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) |
|
NCSW.020 1LBSOLDER WIRE 63/37 TIN/LEAD NO-CL |
13 |
|
Технический лист |
- | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020" (0.51mm) | 361°F (183°C) | No-Clean | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | - |
|
4901-112GSOLDER LF SN99 21GAUGE .25LBS |
7 |
|
Технический лист |
4901 | Spool | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.032" (0.81mm) | 442°F (227°C) | No-Clean | 20 AWG, 21 SWG | - | Lead Free | Spool, 4 oz (113.40g) | 60 Months | Date of Manufacture | 50°F ~ 86°F (10°C ~ 30°C) |
|
T0051386570WSW SAC M1 SN3,0AG0,5CU3,5% |
18 |
|
Технический лист |
Weller® | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.008" (0.20mm) | - | No-Clean | - | - | Lead Free | Spool, 0.35 oz (10g) | - | - | - |
|
SMD2SWLT.047 4OZSOLDER WIRE SN42/BI57.6/AG0.4 .0 |
8 |
|
Технический лист |
SMD2 | Bulk | Active | Wire Solder | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 0.047" (1.19mm) | 280°F (138°C) | - | - | - | Lead Free | Spool, 4 oz (113.40g) | - | - | - |
|
SMD4300AX250T3SOLDER PASTE SN63/PB37 250G |
9 |
|
Технический лист |
CHIPQUIK® SMD4300 | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean, Water Soluble | - | 3 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD2SWLF.012 100GLF SOLDER WIRE 99.3/0.7 TIN/COPP |
17 |
|
Технический лист |
SMD2 | Bulk | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.012" (0.31mm) | 441°F (227°C) | No-Clean, Water Soluble | 28 AWG, 30 SWG | - | Lead Free | Spool, 3.53 oz (100g) | - | - | - |
|
WBNCC633732NO-CLEAN FLUX CORE SOLDER, 63/37 |
14 |
|
Технический лист |
- | Spool | Active | Wire Solder | Sn63Pb37 (63/37) | 0.032" (0.81mm) | 361°F (183°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | - |
|
WBWS633720-1LBSOLDER NO-CLEAN 63/37 .020 1 LB |
12 |
|
Технический лист |
- | Spool | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020" (0.51mm) | - | No-Clean, Water Soluble | - | - | Leaded | Spool, 1 lb (453.59g) | - | - | - |
|
REM4.5-ULTRA-NLULTRA LOW TEMP FLUX CORED CHIP R |
13 |
|
Технический лист |
CHIPQUIK® | Bulk | Active | - | - | - | 144°F (62°C) | No-Clean, Water Soluble | - | - | Lead Free | - | - | - | - |
|
4895-227GSOLDER RA 60/40 .032" 1/2 LB |
8 |
|
Технический лист |
4890 | Spool | Active | Wire Solder | Sn60Pb40 (60/40) | 0.032" (0.81mm) | 361 ~ 376°F (183 ~ 191°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | 60 Months | Date of Manufacture | 50°F ~ 86°F (10°C ~ 30°C) |
|
4887-227GSOLDER RA 63/37 .050" 1/2 LBS |
8 |
|
Технический лист |
4880 | Spool | Active | Wire Solder | Sn63Pb37 (63/37) | 0.050" (1.27mm) | 361°F (183°C) | Rosin Activated (RA) | 16 AWG, 18 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | 60 Months | Date of Manufacture | 50°F ~ 86°F (10°C ~ 30°C) |
|
4884-227GSOLDER RA 63/37 .025" 1/2 LBS |
18 |
|
Технический лист |
4880 | Spool | Active | Wire Solder | Sn63Pb37 (63/37) | 0.025" (0.64mm) | 361°F (183°C) | Rosin Activated (RA) | 22 AWG, 23 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | 60 Months | Date of Manufacture | 50°F ~ 86°F (10°C ~ 30°C) |
|
4885-227GSOLDER RA 63/37 .032" 1/2 LBS |
8 |
|
Технический лист |
4880 | Spool | Active | Wire Solder | Sn63Pb37 (63/37) | 0.032" (0.81mm) | 361°F (183°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | 60 Months | Date of Manufacture | 50°F ~ 86°F (10°C ~ 30°C) |
|
4896-227GSOLDER RA 60/40 .040" 1/2 LB |
18 |
|
Технический лист |
4890 | Spool | Active | Wire Solder | Sn60Pb40 (60/40) | 0.040" (1.02mm) | 361 ~ 376°F (183 ~ 191°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | 60 Months | Date of Manufacture | 50°F ~ 86°F (10°C ~ 30°C) |
|
EXB-SN62PB36AG2SOLDER BAR SN62/PB36/AG2 1LB (45 |
16 |
|
Технический лист |
Super Low Dross™ | Bulk | Active | Bar Solder | Sn62Pb36Ag2 (62/36/2) | - | 354°F (179°C) | - | - | - | Leaded | Bar, 1 lb (454g) | - | - | - |
|
38683260/40 370 3% .064DIA. 14AWG |
36 |
|
Технический лист |
370 | Bulk | Active | Wire Solder | Sn60Pb40 (60/40) | 0.064" (1.63mm) | 361 ~ 374°F (183 ~ 190°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | - | Leaded | Spool, 17.64 oz (500g) | - | - | - |
|
39710263/37 400 2% .048DIA 16AWG |
26 |
|
Технический лист |
C400 | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.048" (1.22mm) | 361°F (183°C) | No-Clean | 16 AWG, 18 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 59°F ~ 86°F (15°C ~ 30°C) |
|
NCSWLF.015 4OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI |
14 |
|
Технический лист |
CHIPQUIK® | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015" (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | - | - | Spool, 4 oz (113.40g) | - | - | - |
|
SMD4300AX250T4SLDR PST WATR SOL 63/37 T4 250G |
10 |
|
Технический лист |
CHIPQUIK® SMD4300 | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean, Water Soluble | - | 4 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
