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| Фото | Номер производителя | Наличие | Количество | Технический лист | Серия | Упаковка | Состояние продукта | Тип | Состав | Диаметр | Точка плавления | Тип флюса | Сечение провода | Тип сетки | Процесс | Форма | Срок хранения | Начало срока годности | Температура хранения/охлаждения |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
16-6337-0125SOLDER 63/37 8AWG 5LB |
6 |
|
Технический лист |
Solid Core Wire | Spool | Active | Wire Solder | Sn63Pb37 (63/37) | 0.125" (3.18mm) | 361°F (183°C) | - | 8 AWG, 10 SWG | - | Leaded | Spool, 5 lbs (2.27kg) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
|
70-1709-0820SOLDER PASTE WATER SOLUBLE 35GM |
7 |
|
Технический лист |
R500 | Bulk | Active | Solder Paste | Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | - | 3 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
|
45031463/37 400 2% .022DIA 23AWG |
22 |
|
Технический лист |
C400 | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.022" (0.56mm) | 361°F (183°C) | No-Clean | 23 AWG, 24 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | - |
|
SMDIN52SN48-1.69X5.71-RINDIUM/TIN SOLDER RIBBON (IN52/S |
12 |
|
Технический лист |
CHIPQUIK® | Bulk | Active | Ribbon Solder | In52Sn48 (52/48) | - | 244°F (118°C) | - | - | - | Lead Free | Spool | - | - | - |
|
SMDIN100-RINDIUM SOLDER RIBBON (IN100) 0.0 |
15 |
|
Технический лист |
SMD | Bulk | Active | Ribbon Solder | In100 (100) | - | 315°F (157°C) | - | - | - | Lead Free | Spool | - | - | - |
|
4895-454GSOLDER RA 60/40 .032" 1 LB |
18 |
|
Технический лист |
4890 | Spool | Active | Wire Solder | Sn60Pb40 (60/40) | 0.032" (0.81mm) | 361 ~ 376°F (183 ~ 191°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | Date of Manufacture | 50°F ~ 86°F (10°C ~ 30°C) |
|
4887-454GSOLDER RA 63/37 1 LB |
10 |
|
Технический лист |
4880 | Spool | Active | Wire Solder | Sn63Pb37 (63/37) | 0.050" (1.27mm) | 361°F (183°C) | Rosin Activated (RA) | 16 AWG, 18 SWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | Date of Manufacture | 50°F ~ 86°F (10°C ~ 30°C) |
|
RASWLF.015 8OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI |
10 |
|
Технический лист |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015" (0.38mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 27 AWG, 28 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | 60 Months | Date of Manufacture | - |
|
NC191LT250T5SMOOTH FLOW LOW TEMP SOLDER PAST |
6 |
|
Технический лист |
Smooth Flow™ | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | No-Clean | - | 5 | Lead Free | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
NC191LTA250T5SMOOTH FLOW LOW TEMP SOLDER PAST |
6 |
|
Технический лист |
Smooth Flow™ | Bulk | Active | Solder Paste | Bi57Sn42Ag1 (57/42/1) | - | 279°F (137°C) | No-Clean | - | 5 | - | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
4884-454GSOLDER RA 63/37 .025" 1 LBS |
6 |
|
Технический лист |
4880 | Spool | Active | Wire Solder | Sn63Pb37 (63/37) | 0.025" (0.64mm) | 361°F (183°C) | Rosin Activated (RA) | 22 AWG, 23 SWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | Date of Manufacture | 50°F ~ 86°F (10°C ~ 30°C) |
|
SMDSWLT.047 8OZSOLDER WIRE SN42/BI57/AG1 .047" |
17 |
|
Технический лист |
SMD | Bulk | Active | Wire Solder | Bi57Sn42Ag1 (57/42/1) | 0.047" (1.19mm) | 280°F (138°C) | - | - | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | - | - | - |
|
SMD291SNLT7SOLDER PASTE NO CLEAN LEAD-FREE |
3 |
|
Технический лист |
- | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 7 | - | Syringe, 0.35 oz (10g), 5cc | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
NCSWLF.015 1LBLF SOLDER WIRE 96.5/3/0.5 TIN/SI |
3 |
|
Технический лист |
CHIPQUIK® | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015" (0.38mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | - | - | Spool, 1 lb (453.592g) | - | - | - |
|
T0051388899WSW SAC L0 SN3,0AG0,5CU3,5% |
5 |
|
Технический лист |
Weller® | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.039" (0.99mm) | - | No-Clean | - | - | Lead Free | Spool, 8.8 oz (250g) | - | - | - |
|
T0051388699WSW SAC M1 SN3,0AG0,5CU3,5% |
4 |
|
Технический лист |
Weller® | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.039" (0.99mm) | - | No-Clean | - | - | Lead Free | Spool, 8.8 oz (250g) | - | - | - |
|
SMDSWLF.008 50GLF SOLDER WIRE 96.5/3/0.5 TIN/SI |
20 |
|
Технический лист |
SMD | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.008" (0.20mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 32 AWG, 35 SWG | - | Lead Free | Spool, 1.76 oz (50g) | - | - | - |
|
T0051387399WSW SC M1 1,2MM SN0,7CU3,5% |
13 |
|
Технический лист |
Weller® | Spool | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.047" (1.19mm) | - | No-Clean | - | - | Lead Free | Spool, 17.64 oz (500g) | - | - | - |
|
T0051387499WSW SC M1 1,0MM SN0,7CU3,5% |
8 |
|
Технический лист |
Weller® | Spool | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.039" (0.99mm) | - | No-Clean | - | - | Lead Free | Spool, 17.64 oz (500g) | - | - | - |
|
SMD2SWLT.040 50GSN42/BI57.6/AG0.4 2.2% FLUX CORE |
6 |
|
Технический лист |
SMD2 | Bulk | Active | Wire Solder | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | - | Lead Free | Spool, 1.8 oz (50g) | - | - | - |
