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| Фото | Номер производителя | Наличие | Количество | Технический лист | Серия | Упаковка | Состояние продукта | Тип | Состав | Диаметр | Точка плавления | Тип флюса | Сечение провода | Тип сетки | Процесс | Форма | Срок хранения | Начало срока годности | Температура хранения/охлаждения |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SMD291SNL15T4SOLDER PASTE TWO PART MIX |
15 |
|
Технический лист |
- | Bulk | Active | Solder Paste, Two Part Mix | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Jar, 0.53 oz (15g) | 24 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) |
|
SSWS-35GSOLDER PASTE WATER SOLUBLE 63/37 |
20 |
|
Технический лист |
- | Bag | Active | Solder Paste | Sn63Pb37 (63/37) | - | - | Water Soluble | - | 3 | - | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture | 37°F ~ 42°F (3°C ~ 6°C) |
|
SMDLTLFP50T3SLDR PASTE NO-CLN SN42/BI58 50G |
16 |
|
Технический лист |
- | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 3 | Lead Free | Jar, 1.76 oz (50g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
RASWLF.020 4OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI |
42 |
|
Технический лист |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | - | Lead Free | Spool, 4 oz (113.40g) | - | - | - |
|
SMD2060-25000SOLDER SPHERES SAC305 .030" DIAM |
11 |
|
Технический лист |
SMD2 | Bulk | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.030" (0.76mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - |
|
SMD2140-25000SOLDER SPHERES SN63/PB37 .008" ( |
7 |
|
Технический лист |
SMD2 | Bulk | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.008" (0.20mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture | - |
|
T0051404799WSW SCN M1 SN0,6CU0,05NI3,5% |
33 |
|
Технический лист |
Weller® | Spool | Active | Wire Solder | Sn99.3Cu0.6Ni0.05 (99.3/0.6/0.05) | 0.020" (0.51mm) | - | No-Clean | - | - | Lead Free | Spool, 3.53 oz (100g) | - | - | - |
|
4902P-15GLEAD FREE LOW TEMPERATURE SOLDER |
40 |
|
Технический лист |
4902 | Bulk | Active | Solder Paste | Bi57Sn42Ag1 (57/42/1) | - | 281°F (138°C) | No-Clean | - | - | Lead Free | Syringe, 0.53 oz (15g), 5cc | 24 Months | Date of Manufacture | 39°F ~ 50°F (4°C ~ 10°C) |
|
RASWLF.015 4OZLF SOLDER WIRE 96.5/3/0.5 TIN/SI |
20 |
|
Технический лист |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015" (0.38mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 27 AWG, 28 SWG | - | Lead Free | Spool, 4 oz (113.40g) | - | - | - |
|
EXB-SN60PB40SOLDER BAR SN60/PB40 1LB (454G) |
22 |
|
Технический лист |
Super Low Dross™ | Bulk | Active | Bar Solder | Sn60Pb40 (60/40) | - | 361 ~ 370°F (183 ~ 188°C) | - | - | - | Leaded | Bar, 1 lb (454g) | - | - | - |
|
SMD2SW.031 8OZSOLDER WIRE 60/40 TIN/LEAD NO-CL |
26 |
|
Технический лист |
SMD2 | Bulk | Active | Wire Solder | Sn60Pb40 (60/40) | 0.031" (0.79mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | - | - | - |
|
DKS-SOLDERPASTE15GSOLDER PASTE NO-CLEAN 63/37 5CC |
78 |
|
Технический лист |
DIGIKEY STANDARD | Bag | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 3 | Leaded | Syringe, 0.53 oz (15g), 5cc | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMDSWLTLFP16SOLDER WIRE SN42/BI57/AG1 LEAD-F |
18 |
|
Технический лист |
CHIPQUIK® | Bulk | Active | Wire Solder | Sn42Bi57Ag1 (42/57/1) | 0.030" (0.76mm) | 281°F (138°C) | - | - | - | Lead Free | Tube | 60 Months | Date of Manufacture | - |
|
NC191AX35T5SMOOTH FLOW LEADED SOLDER PASTE |
11 |
|
Технический лист |
Smooth Flow™ | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 5 | Leaded | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMDLTLFPT5SOLDER PASTE NO CLEAN SN42/BI57. |
10 |
|
Технический лист |
SMD | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 5 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
NC191LT35T5SMOOTH FLOW LOW TEMP SOLDER PAST |
7 |
|
Технический лист |
Smooth Flow™ | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | No-Clean | - | 5 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD2SW.020 8OZSOLDER WIRE 60/40 TIN/LEAD NO-CL |
13 |
|
Технический лист |
SMD2 | Bulk | Active | Wire Solder | Sn60Pb40 (60/40) | 0.020" (0.51mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | - | - | - |
|
SMD2040-25000SOLDER SPHERES SAC305 .020" DIAM |
9 |
|
Технический лист |
SMD2 | Bulk | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - |
|
SMDSW.031 8OZSOLDER WIRE 63/37 TIN/LEAD NO-CL |
13 |
|
Технический лист |
- | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031" (0.79mm) | 361°F (183°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | - | - | - |
|
|
4900-18GSAC305, Sn96.2Ag2.8Cu0.4 2PK |
12 |
|
Технический лист |
4900 | Box | Active | Wire Solder | Sn96.2Ag2.8Cu0.4 (96.2/2.8/0.4) | 0.032" (0.81mm) | 423°F (217°C) | No-Clean, Rosin Activated (RA) | 21 AWG, 21 SWG | - | Lead Free | Tube, 0.74 oz (21g) | 60 Months | Date of Manufacture | 50°F ~ 86°F (10°C ~ 30°C) |
