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| Фото | Номер производителя | Наличие | Количество | Технический лист | Серия | Упаковка | Состояние продукта | Тип | Состав | Диаметр | Точка плавления | Тип флюса | Сечение провода | Тип сетки | Процесс | Форма | Срок хранения | Начало срока годности | Температура хранения/охлаждения |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SMDSW.020 8OZSOLDER WIRE 63/37 TIN/LEAD NO-CL |
8 |
|
Технический лист |
- | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020" (0.51mm) | 361°F (183°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | - | - | - |
|
WBWSSAC31-4OZSOLDER NC SAC305 .031 4 OZ |
17 |
|
Технический лист |
- | Spool | Active | Wire Solder | Sn96.5Ag3.0Cu0.5 (96.5/3.0/0.5) | 0.020" (0.51mm) | - | Water Soluble | - | - | Lead Free | Spool, 4 oz (113.40g) | 24 Months | Date of Manufacture | - |
|
WBNCSAC31-4OZLEAD FREE NO-CLEAN FLUX CORE SIL |
10 |
|
Технический лист |
- | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 430°F (221°C) | No-Clean | 20 AWG, 21 SWG | - | Lead Free | Spool, 4 oz (113.40g) | - | - | - |
|
SMD291SNLT5SOLDER PASTE NO CLEAN LEAD-FREE |
9 |
|
Технический лист |
SMD2 | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD2036-25000SOLDER SPHERES SN96.5/AG3.0/CU0. |
7 |
|
Технический лист |
SMD2 | Bulk | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.018" (0.46mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - |
|
SMDAL10ALUMINUM SOLDER PASTE WATER-SOLU |
8 |
|
Технический лист |
SMD | Bulk | Active | Solder Paste | Sn96.5Ag3.5 (96.5/3.5) | - | 430°F (221°C) | Water Soluble | - | 3 | Lead Free | Syringe, 0.88 oz (25g), 10cc | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD3SW.015 100GSOLDER WIRE 62/36/2 TIN/LEAD/SIL |
20 |
|
Технический лист |
SMD3 | Bulk | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.015" (0.38mm) | 354°F (179°C) | No-Clean, Water Soluble | 27 AWG, 28 SWG | - | Leaded | Spool, 3.53 oz (100g) | - | - | - |
|
WBNCSAC20-4OZLEAD FREE NO-CLEAN FLUX CORE SIL |
20 |
|
Технический лист |
- | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 430°F (221°C) | No-Clean | 24 AWG, 25 SWG | - | Lead Free | Spool, 4 oz (113.40g) | - | - | - |
|
SMD2032-25000SOLDER SPHERES SN96.5/AG3.0/CU0. |
11 |
|
Технический лист |
SMD2 | Bulk | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.016" (0.40mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - |
|
TS391AX10THERMALLY STABLE SOLDER PASTE NO |
12 |
|
Технический лист |
- | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) |
|
SMD2028-25000SOLDER SPHERES SN96.5/AG3.0/CU0. |
15 |
|
Технический лист |
SMD2 | Bulk | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.014" (0.36mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - |
|
REM2.7-ULTRA-NLULTRA LOW TEMP FLUX CORED CHIP R |
6 |
|
Технический лист |
CHIPQUIK® | Bulk | Active | - | - | - | 144°F (62°C) | No-Clean, Water Soluble | - | - | Lead Free | - | - | - | - |
|
SMD4300AX10T4SLDR PST WATR SOL 63/37 T4 10CC |
12 |
|
Технический лист |
CHIPQUIK® SMD4300 | Dispenser | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean, Water Soluble | - | 4 | Leaded | Syringe, 1.23 oz (35g), 10cc | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
NC191LT50T5SMOOTH FLOW LOW TEMP SOLDER PAST |
6 |
|
Технический лист |
Smooth Flow™ | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | No-Clean | - | 5 | Lead Free | Jar, 1.76 oz (50g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD2024-25000SOLDER SPHERES SN96.5/AG3.0/CU0. |
7 |
|
Технический лист |
SMD2 | Bulk | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.012" (0.31mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - |
|
NC2SW.015 4OZSOLDER WIRE 60/40 TIN/LEAD (SN60 |
8 |
|
Технический лист |
CHIPQUIK® | Bulk | Active | Wire Solder | Sn60Pb40 (60/40) | 0.015" (0.38mm) | 361°F ~ 370°F (183°C ~ 188°C) | No-Clean | - | - | Leaded | Spool, 4 oz (113.40g) | - | - | - |
|
RASW.031 8OZSOLDER WIRE 63/37 TIN/LEAD ROSIN |
10 |
|
Технический лист |
- | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031" (0.79mm) | 361°F (183°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | - | - | - |
|
BARSN60PB40SOLDER BAR SN60/PB40 1LB SUPER L |
6 |
|
Технический лист |
Super Low Dross™ | Bulk | Active | Bar Solder | Sn60Pb40 (60/40) | - | 361 ~ 370°F (183 ~ 188°C) | - | - | - | Leaded | Bar, 1 lb (454g) | - | - | - |
|
SMD2020-25000SOLDER SPHERES SN96.5/AG3.0/CU0. |
9 |
|
Технический лист |
SMD2 | Bulk | Active | Solder Sphere | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.010" (0.25mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | - | Lead Free | Jar | 24 Months | Date of Manufacture | - |
|
RASW.020 8OZSOLDER WIRE 63/37 TIN/LEAD ROSIN |
12 |
|
Технический лист |
- | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020" (0.51mm) | 361°F (183°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | - | - | - |
