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| Фото | Номер производителя | Наличие | Количество | Технический лист | Серия | Упаковка | Состояние продукта | Тип | Состав | Диаметр | Точка плавления | Тип флюса | Сечение провода | Тип сетки | Процесс | Форма | Срок хранения | Начало срока годности | Температура хранения/охлаждения |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
WBNCSAC31-2OZLEAD FREE NO-CLEAN FLUX CORE SIL |
16 |
|
Технический лист |
- | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.031" (0.79mm) | 430°F (221°C) | No-Clean | 20 AWG, 21 SWG | - | Lead Free | Spool, 2 oz (56.70g) | - | - | - |
|
TS391AX50THERMALLY STABLE SOLDER PASTE NO |
33 |
|
Технический лист |
- | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Jar, 1.76 oz (50g) | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) |
|
NC191SNL50SMOOTH FLOW LEAD-FREE SOLDER PAS |
25 |
|
Технический лист |
Smooth Flow™ | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 4 | Lead Free | Jar, 1.76 oz (50g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
WBNCC633731-4OZNO-CLEAN FLUX CORE SOLDER, 63/37 |
28 |
|
Технический лист |
- | Spool | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031" (0.79mm) | 361°F (183°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Spool, 4 oz (113.40g) | - | - | - |
|
SSLFNC-15GSAC 305 LEAD FREE SOLDER PASTE T |
12 |
|
Технический лист |
- | Bag | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 3 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SSLTNC-15GLOW TEMPERATURE LEAD FREE SOLDER |
7 |
|
Технический лист |
- | Bag | Active | Solder Paste | Bi57Sn42Ag1 (57/42/1) | - | 279°F (137°C) | No-Clean | - | 3 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
NC2SW.015 1OZSOLDER WIRE 60/40 TIN/LEAD (SN60 |
6 |
|
Технический лист |
CHIPQUIK® | Bulk | Active | Wire Solder | Sn60Pb40 (60/40) | 0.015" (0.38mm) | 361°F ~ 370°F (183°C ~ 188°C) | No-Clean | - | - | Leaded | Spool, 1 oz (28.35g) | - | - | - |
|
SMD3SWLT.047 1OZSOLDER WIRE SN42/BI58 .047" 1OZ |
20 |
|
Технический лист |
SMD3 | Bulk | Active | Wire Solder | Bi58Sn42 (58/42) | 0.047" (1.19mm) | 280°F (138°C) | - | - | - | Lead Free | Spool, 1 oz (28.35g) | - | - | - |
|
T0051403099WSW SNPB L1, 1,0MM, 100G |
54 |
|
Технический лист |
Weller® | Spool | Active | Wire Solder | Sn60Pb40 (60/40) | 0.039" (0.99mm) | - | No-Clean | - | - | Leaded | Spool, 3.53 oz (100g) | - | - | - |
|
NC191LT15T5SMOOTH FLOW LOW TEMP SOLDER PAST |
17 |
|
Технический лист |
Smooth Flow™ | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 280°F (138°C) | No-Clean | - | 5 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
NC191LTA15T5SMOOTH FLOW LOW TEMP SOLDER PAST |
16 |
|
Технический лист |
Smooth Flow™ | Bulk | Active | Solder Paste | Bi57Sn42Ag1 (57/42/1) | - | 279°F (137°C) | No-Clean | - | 5 | - | Syringe, 0.53 oz (15g), 5cc | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMDSWLF.006 1GSOLDER WIRE SN96.5/AG3/CU0.5 |
9 |
|
Технический лист |
- | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.006" (0.15mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | - | Lead Free | Spool, 0.035 oz (1g) | - | - | - |
|
WBWSSAC20-2OZSOLDER NC SAC305 .020 2 OZ |
53 |
|
Технический лист |
- | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | - | Water Soluble | - | - | Lead Free | Spool, 2 oz (56.70g) | 24 Months | Date of Manufacture | - |
|
WBNCC633720-4OZNO-CLEAN FLUX CORE SOLDER, 63/37 |
19 |
|
Технический лист |
- | Spool | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020" (0.51mm) | 361°F (183°C) | No-Clean | 24 AWG, 25 SWG | - | Leaded | Spool, 4 oz (113.40g) | 24 Months | Date of Manufacture | - |
|
WBNCSAC20-2OZLEAD FREE NO-CLEAN FLUX CORE SIL |
17 |
|
Технический лист |
- | Spool | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 430°F (221°C) | No-Clean | 24 AWG, 25 SWG | - | Lead Free | Spool, 2 oz (56.70g) | - | - | - |
|
SMD2SW.015 100GSOLDER WIRE 60/40 TIN/LEAD NO-CL |
27 |
|
Технический лист |
SMD2 | Bulk | Active | Wire Solder | Sn60Pb40 (60/40) | 0.015" (0.38mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | 27 AWG, 28 SWG | - | Leaded | Spool, 3.53 oz (100g) | - | - | - |
|
T0051403199WSW SNPB L1, 0.8MM, 100G |
19 |
|
Технический лист |
Weller® | Spool | Active | Wire Solder | Sn60Pb40 (60/40) | 0.031" (0.79mm) | - | No-Clean | - | - | Leaded | Spool, 3.53 oz (100g) | - | - | - |
|
SMD2SWLT.047 1OZSOLDER WIRE SN42/BI57.6/AG0.4 .0 |
8 |
|
Технический лист |
SMD2 | Bulk | Active | Wire Solder | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 0.047" (1.19mm) | 280°F (138°C) | - | - | - | Lead Free | Spool, 1 oz (28.35g) | - | - | - |
|
SMD2215-25000SOLDER SPHERES SN63/PB37 .030" D |
14 |
|
Технический лист |
SMD2 | Bulk | Active | Solder Sphere | Sn63Pb37 (63/37) | 0.030" (0.76mm) | 361°F (183°C) | - | - | - | Leaded | Jar | 24 Months | Date of Manufacture | - |
|
SMD2SW.031 4OZSOLDER WIRE 60/40 TIN/LEAD NO-CL |
26 |
|
Технический лист |
SMD2 | Bulk | Active | Wire Solder | Sn60Pb40 (60/40) | 0.031" (0.79mm) | 361 ~ 370°F (183 ~ 188°C) | No-Clean, Water Soluble | - | - | Leaded | Spool, 4 oz (113.40g) | - | - | - |
