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| Фото | Номер производителя | Наличие | Количество | Технический лист | Серия | Упаковка | Состояние продукта | Тип | Количество положений или контактов (сетка) | Шаг - Сопряжение | Отделка контакта - Сопряжение | Толщина отделки контакта - Сопряжение | Материал контакта - Сопряжение | Тип крепления | Особенности | Оконечная нагрузка | Шаг - Пост | Отделка контакта - Пост | Толщина отделки контакта - Пост | Материал контакта - Пост | Материал корпуса | Рабочая температура |
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34-6511-10CONN IC DIP SOCKET 34POS TIN |
0 |
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Технический лист |
511 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 34 (2 x 17) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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34-6511-11CONN IC DIP SOCKET 34POS GOLD |
0 |
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Технический лист |
511 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 34 (2 x 17) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
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02-0501-30CONN SOCKET SIP 2POS TIN |
0 |
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Технический лист |
501 | Bulk | Active | SIP | 2 (1 x 2) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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03-0501-21CONN SOCKET SIP 3POS GOLD |
0 |
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Технический лист |
501 | Bulk | Active | SIP | 3 (1 x 3) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
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07-7XXXX-10CONN SOCKET SIP 7POS TIN |
0 |
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Технический лист |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 7 (1 x 7) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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12-7XXXX-10CONN SOCKET SIP 12POS TIN |
0 |
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Технический лист |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 12 (1 x 12) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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20-7XXXX-10CONN SOCKET SIP 20POS TIN |
0 |
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Технический лист |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 20 (1 x 20) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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25-7XXXX-10CONN SOCKET SIP 25POS TIN |
0 |
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Технический лист |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 25 (1 x 25) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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33-7XXXX-10CONN SOCKET SIP 33POS TIN |
0 |
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Технический лист |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 33 (1 x 33) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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35-7XXXX-10CONN SOCKET SIP 35POS TIN |
0 |
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Технический лист |
700 Elevator Strip-Line™ | Bulk | Active | SIP | 35 (1 x 35) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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1109011SERIES 513 LO-PRO W/SOLDER TAIL |
0 |
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Технический лист |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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4236-118-14518 OPN FRM COLLET SCKT SLDR TAI |
0 |
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Технический лист |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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2357-108-12EJECT-A-DP LCK/EJCT SCKT SLDR TL |
0 |
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Технический лист |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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34-6823-90CONN IC DIP SOCKET 34POS GOLD |
0 |
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Технический лист |
Vertisockets™ 800 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 34 (2 x 17) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6 | - |
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1109785800 VERTISOCKET HORIZONTAL MOUNT |
0 |
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Технический лист |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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14-8470-10CONN IC DIP SOCKET 14POS TIN |
0 |
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Технический лист |
8 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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10-28440-10CONN IC DIP SOCKET 10POS TIN |
0 |
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Технический лист |
8 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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18-68500-10CONN IC DIP SOCKET 18POS TIN |
0 |
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Технический лист |
8 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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08-8620-210CCONN IC DIP SOCKET 8POS GOLD |
0 |
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Технический лист |
8 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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10-8300-210CCONN IC DIP SOCKET 10POS GOLD |
0 |
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Технический лист |
8 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
