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| Фото | Номер производителя | Наличие | Количество | Технический лист | Серия | Упаковка | Состояние продукта | Тип | Количество положений или контактов (сетка) | Шаг - Сопряжение | Отделка контакта - Сопряжение | Толщина отделки контакта - Сопряжение | Материал контакта - Сопряжение | Тип крепления | Особенности | Оконечная нагрузка | Шаг - Пост | Отделка контакта - Пост | Толщина отделки контакта - Пост | Материал контакта - Пост | Материал корпуса | Рабочая температура |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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8080-1G2CONN SOCKET TRANSIST TO-3 3POS |
0 |
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Технический лист |
- | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Silver | 500.0µin (12.70µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Silver | - | Beryllium Copper | Diallyl Phthalate (DAP) | -55°C ~ 125°C |
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8080-1G3CONN SOCKET TRANSIST TO-3 3POS |
0 |
|
Технический лист |
- | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Tin-Lead | - | Beryllium Copper | Phenolic | -55°C ~ 125°C |
|
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8080-1G35CONN SOCKET TRANSIST TO-3 3POS |
0 |
|
Технический лист |
- | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Tin-Lead | 20.0µin (0.51µm) | Beryllium Copper | Diallyl Phthalate (DAP) | -55°C ~ 125°C |
|
|
8080-1G36CONN SOCKET TRANSIST TO-3 3POS |
0 |
|
Технический лист |
- | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Silver | 500.0µin (12.70µm) | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Silver | 500.0µin (12.70µm) | Beryllium Copper | Phenolic | -55°C ~ 125°C |
|
|
8080-1G37CONN SOCKET TRANSIST TO-3 3POS |
0 |
|
Технический лист |
- | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | - | Silver | 500.0µin (12.70µm) | Beryllium Copper | Chassis Mount | Closed Frame | Solder | - | Silver | 500.0µin (12.70µm) | Beryllium Copper | Diallyl Phthalate (DAP) | -55°C ~ 125°C |
|
|
8-1437504-6CONN SOCKET TRANSIST TO-3 3POS |
0 |
|
Технический лист |
8080 | Bulk | Active | Transistor, TO-3 | 3 (Oval) | - | Gold | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Diallyl Phthalate (DAP) | -55°C ~ 125°C |
|
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824-AG66DCONN IC DIP SOCKET 24POS GOLD |
0 |
|
Технический лист |
800 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 80.0µin (2.03µm) | Copper Alloy | Polyester | -55°C ~ 105°C |
|
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9-1437537-3CONN IC DIP SOCKET 3POS GOLD |
0 |
|
Технический лист |
800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 3 (1 x 3) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 80.0µin (2.03µm) | Copper Alloy | Polyester | -55°C ~ 105°C |
|
|
9-1437539-6CONN IC DIP SOCKET 6POS GOLD |
0 |
|
Технический лист |
800 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 80.0µin (2.03µm) | Copper Alloy | Polyester | -55°C ~ 105°C |
|
|
2040636-5CONN SOCKET LGA 1567POS GOLD |
0 |
|
Технический лист |
- | Tray | Active | LGA | 1567 | 0.040" (1.02mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.039" (1.00mm) | - | - | Copper Alloy | Thermoplastic | - |
|
|
1977291-1CONN IC DIP SOCKET 20POS GOLD |
0 |
|
Технический лист |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | - | - | Brass | Thermoplastic, Polyester | - |
|
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8-1437529-1CONN IC DIP SOCKET 8POS GOLD |
0 |
|
Технический лист |
500 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 47.2µin (1.20µm) | Copper Alloy | Thermoplastic, Polyester | -55°C ~ 105°C |
|
|
1825088-2CONN IC DIP SOCKET 12POS GOLD |
0 |
|
Технический лист |
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 (2 x 6) | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Press-Fit | 0.100" (2.54mm) | - | - | Brass | Thermoplastic, Polyester | - |
|
|
8-1437531-4520-AG11F=SOCKET ASSY |
0 |
|
Технический лист |
500 | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
1747890-1DSL ASSY LGA771 LEADED |
0 |
|
Технический лист |
- | Tray | Active | LGA | 771 (33 x 33) | 0.043" (1.09mm) | - | - | Copper Alloy | Surface Mount | - | Solder | 0.043" (1.09mm) | Tin | - | - | Thermoplastic | -25°C ~ 100°C |
|
|
1-1981837-2CONN SOCKET LGA 1366POS GOLD |
0 |
|
Технический лист |
- | Tray | Active | LGA | 1366 (32 x 41) | 0.040" (1.02mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.040" (1.01mm) | - | - | - | Thermoplastic | - |
|
|
1825532-4CONN SOCKET SIP 10POS GOLD |
0 |
|
Технический лист |
- | - | Obsolete | SIP | 10 (1 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | Flash | Beryllium Copper | Polyester | - |
|
|
4-2013620-3CONN SOCKET PGA ZIF 989POS GOLD |
0 |
|
Технический лист |
- | Tape & Reel (TR) | Active | PGA, ZIF (ZIP) | 989 (35 x 36) | 0.039" (1.00mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.039" (1.00mm) | Tin-Lead | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic | - |
|
|
1-2013620-1CONN SOCKET PGA ZIF 989POS GOLD |
0 |
|
Технический лист |
- | Tape & Reel (TR) | Active | PGA, ZIF (ZIP) | 989 (35 x 36) | 0.039" (1.00mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.039" (1.00mm) | Tin-Lead | 15.0µin (0.38µm) | Copper Alloy | Thermoplastic | - |
|
|
9-6437529-4CONN IC DIP SOCKET 8POS GOLD |
0 |
|
Технический лист |
- | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Thermoplastic, Polyester | - |
