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EASTECH Electronics

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Фото Номер производителя Наличие Цена Количество Технический лист Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура
1-2199298-2

1-2199298-2

CONN IC DIP SOCKET 8POS TIN

TE Connectivity AMP Connectors

9,722
1-2199298-2

Технический лист

Diplomate DL Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass, Copper Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
A 14-LC-TT

A 14-LC-TT

CONN IC DIP SOCKET 14POS TIN

Assmann WSW Components

15,964
A 14-LC-TT

Технический лист

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
ED281DT

ED281DT

CONN IC DIP SOCKET 28POS TIN

On Shore Technology Inc.

4,058
ED281DT

Технический лист

ED Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 110°C
SA083040

SA083040

CONN IC DIP SOCKET 8POS GOLD

On Shore Technology Inc.

1,301
SA083040

Технический лист

SA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 80.0µin (2.03µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
110-87-308-41-001101

110-87-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

20,714
110-87-308-41-001101

Технический лист

110 Box Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
AR 08-HZL-TT

AR 08-HZL-TT

CONN IC DIP SOCKET 8POS TIN

Assmann WSW Components

20,914
AR 08-HZL-TT

Технический лист

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
4808-3004-CP

4808-3004-CP

CONN IC DIP SOCKET 8POS TIN

3M

37,370
4808-3004-CP

Технический лист

4800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 35.0µin (0.90µm) Phosphor Bronze Polyester, Glass Filled -25°C ~ 85°C
A 40-LC-TT

A 40-LC-TT

CONN IC DIP SOCKET 40POS TIN

Assmann WSW Components

1,066
A 40-LC-TT

Технический лист

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT) -55°C ~ 85°C
110-44-308-41-001000

110-44-308-41-001000

CONN IC DIP SOCKET 8POS TIN

Mill-Max Manufacturing Corp.

4,620
110-44-308-41-001000

Технический лист

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
SA143000

SA143000

CONN IC DIP SOCKET 14POS GOLD

On Shore Technology Inc.

2,371
SA143000

Технический лист

SA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
SA163000

SA163000

CONN IC DIP SOCKET 16POS GOLD

On Shore Technology Inc.

2,514
SA163000

Технический лист

SA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Thermoplastic, Polyester, Glass Filled -40°C ~ 105°C
DILB40P-223TLF

DILB40P-223TLF

CONN IC DIP SOCKET 40POS TIN

Amphenol ICC (FCI)

6,719
DILB40P-223TLF

Технический лист

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame Solder 0.100" (2.54mm) Tin 100.0µin (2.54µm) Copper Alloy Polyamide (PA), Nylon -55°C ~ 105°C
AR 16-HZL-TT

AR 16-HZL-TT

CONN IC DIP SOCKET 16POS TIN

Assmann WSW Components

3,453
AR 16-HZL-TT

Технический лист

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
110-43-308-41-001000

110-43-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

14,042
110-43-308-41-001000

Технический лист

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-93-308-41-001000

110-93-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

2,161
110-93-308-41-001000

Технический лист

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
A-CCS 032-Z-SM

A-CCS 032-Z-SM

IC PLCC SOCKET 32POS TIN SMD

Assmann WSW Components

766
A-CCS 032-Z-SM

Технический лист

- Tube Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 160.0µin (4.06µm) Phosphor Bronze Polyamide (PA9T), Nylon 9T, Glass Filled -40°C ~ 105°C
110-99-316-41-001000

110-99-316-41-001000

CONN IC DIP SOCKET 16POS TINLEAD

Mill-Max Manufacturing Corp.

1,423
110-99-316-41-001000

Технический лист

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
110-87-308-41-105191

110-87-308-41-105191

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

3,488
110-87-308-41-105191

Технический лист

110 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
1050281001

1050281001

CONN CAM SOCKET 32POS GOLD

Molex

14,741
1050281001

Технический лист

105028 Tape & Reel (TR) Active Camera Socket 32 (4 x 8) 0.035" (0.90mm) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Open Frame Solder 0.035" (0.90mm) Nickel 50.0µin (1.27µm) Copper Alloy Thermoplastic -
69802-432LF

69802-432LF

CONN SOCKET PLCC 32POS TIN

Amphenol ICC (FCI)

209
69802-432LF

Технический лист

- Tape & Reel (TR) Active PLCC 32 (2 x 7, 2 x 9) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame Solder 0.050" (1.27mm) Tin 150.0µin (3.81µm) Phosphor Bronze Polyphenylene Sulfide (PPS) -55°C ~ 125°C
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