Пожалуйста, свяжитесь с нами для получения актуальной информации о ценах и наличии товара.

Гнезда для ИС

Фото Номер производителя Наличие Цена Количество Технический лист Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура
2013620-1

2013620-1

CONN SOCKET PGA ZIF 989POS GOLD

TE Connectivity AMP Connectors

0

-

- Tray Active PGA, ZIF (ZIP) 989 (35 x 36) 0.039" (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.039" (1.00mm) - - Copper Alloy Thermoplastic -
1981837-1

1981837-1

CONN SOCKET LGA 1366POS GOLD

TE Connectivity AMP Connectors

0
1981837-1

Технический лист

- Tray Obsolete LGA 1366 (32 x 41) 0.040" (1.02mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.040" (1.01mm) - - Copper Alloy Thermoplastic -
8080-1G3-LF

8080-1G3-LF

CONN TRANSIST TO-3 3POS TIN

TE Connectivity AMP Connectors

0
8080-1G3-LF

Технический лист

8080 Bulk Obsolete Transistor, TO-3 3 (Oval) - Tin 200.0µin (5.08µm) Beryllium Copper Chassis Mount Closed Frame Solder - Tin 200.0µin (5.08µm) Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
8-1437504-2

8-1437504-2

CONN TRANSIST TO-3 3POS TIN

TE Connectivity AMP Connectors

0
8-1437504-2

Технический лист

8080 Bulk Obsolete Transistor, TO-3 3 (Oval) - Tin 200.0µin (5.08µm) Beryllium Copper Chassis Mount Closed Frame Solder - Tin 200.0µin (5.08µm) Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
8-1437504-0

8-1437504-0

CONN TRANSIST TO-3 3POS GOLD

TE Connectivity AMP Connectors

0
8-1437504-0

Технический лист

8080 Bulk Obsolete Transistor, TO-3 3 (Oval) - Gold 30.0µin (0.76µm) Beryllium Copper Chassis Mount Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
9-1437504-7

9-1437504-7

CONN TRANSIST TO-3 3POS TIN

TE Connectivity AMP Connectors

0
9-1437504-7

Технический лист

8080 Bulk Obsolete Transistor, TO-3 3 (Oval) - Tin 200.0µin (5.08µm) Beryllium Copper Chassis Mount Closed Frame Solder - Tin 200.0µin (5.08µm) Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
9-1437504-1

9-1437504-1

CONN TRANSIST TO-3 3POS GOLD

TE Connectivity AMP Connectors

0
9-1437504-1

Технический лист

8080 Bulk Obsolete Transistor, TO-3 3 (Oval) - Gold 30.0µin (0.76µm) Beryllium Copper Chassis Mount Closed Frame Solder - Gold 30.0µin (0.76µm) Beryllium Copper Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
8058-1G29

8058-1G29

CONN TRANSIST TO-5 3POS GOLD

TE Connectivity AMP Connectors

0
8058-1G29

Технический лист

8058 Bulk Active Transistor, TO-5 3 (Round) - Gold - Beryllium Copper Panel Mount Closed Frame Solder - Gold - Brass Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
8058-1G45

8058-1G45

CONN TRANSIST TO-5 8POS GOLD

TE Connectivity AMP Connectors

0
8058-1G45

Технический лист

8058 Bulk Obsolete Transistor, TO-5 8 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Brass Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
8058-1G59

8058-1G59

CONN TRANSIST TO-5 3POS GOLD

TE Connectivity AMP Connectors

0
8058-1G59

Технический лист

8058 Bulk Active Transistor, TO-5 3 (Round) - Gold - Beryllium Copper Through Hole Closed Frame Solder - Gold - Brass Polytetrafluoroethylene (PTFE) -55°C ~ 125°C
5-6437504-0

5-6437504-0

CONN TRANSIST TO-3 3POS SILVER

TE Connectivity AMP Connectors

0
5-6437504-0

Технический лист

8080 Bulk Obsolete Transistor, TO-3 3 (Oval) - Silver - Beryllium Copper Chassis Mount Closed Frame Solder - Silver - Beryllium Copper Diallyl Phthalate (DAP) -55°C ~ 125°C
1-1747890-2

1-1747890-2

CONN SOCKET LGA 771POS GOLD

TE Connectivity AMP Connectors

0
1-1747890-2

Технический лист

- Tray Obsolete LGA 771 (33 x 33) 0.043" (1.09mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.043" (1.09mm) - - - Thermoplastic -25°C ~ 100°C
XR2C-3200-HSG

XR2C-3200-HSG

CONN IC SOCKET 32POS

Omron Electronics Inc-EMC Div

0
XR2C-3200-HSG

Технический лист

XR2 Bulk Active Housing 32 (1 x 32) 0.100" (2.54mm) - - Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) - - Beryllium Copper Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
PLCC-044-F-N

PLCC-044-F-N

CONN SOCKET PLCC 44POS GOLD

Samtec Inc.

0
PLCC-044-F-N

Технический лист

PLCC Tube Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Gold Flash Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
PLCC-044-T-N

PLCC-044-T-N

CONN SOCKET PLCC 44POS TIN

Samtec Inc.

0
PLCC-044-T-N

Технический лист

PLCC Tube Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Tin - Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
PLCC-084-T-N

PLCC-084-T-N

CONN SOCKET PLCC 84POS TIN

Samtec Inc.

0
PLCC-084-T-N

Технический лист

PLCC Tube Obsolete PLCC 84 (4 x 21) 0.050" (1.27mm) Tin - Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
IC-628-SGG

IC-628-SGG

CONN IC DIP SOCKET 28POS GOLD

Samtec Inc.

0
IC-628-SGG

Технический лист

IC Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Phosphor Bronze Polyester, Glass Filled -55°C ~ 125°C
ICO-314-SST-L

ICO-314-SST-L

CONN IC DIP SOCKET 14POS GOLD

Samtec Inc.

0
ICO-314-SST-L

Технический лист

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 125°C
0475939000

0475939000

CONN SOCKET LGA 1366POS NICKEL

Molex

0
0475939000

Технический лист

47594 Tray Obsolete LGA 1366 (32 x 41) - Nickel 3.00µin (0.076µm) - Surface Mount Closed Frame Solder - Nickel 3.00µin (0.076µm) - - -
CUSTOM BGA

CUSTOM BGA

CONN SOCKET BGA CUSTOM

3M

0
CUSTOM BGA

Технический лист

Textool™ - Active BGA Custom 0.026" ~ 0.050" (0.65mm ~ 1.27mm) Custom Custom - Through Hole Custom - - - - - - -
Total 19086 Record«Prev1... 935936937938939940941942...955Next»

Начать сейчас!

Получайте последние новости

EASTECH Electronics

Главная

EASTECH Electronics

Поиск

EASTECH Electronics

Продукты

EASTECH Electronics

Whatsapp

Отправка...
×
Отправлено успешно!
Спасибо за вашу заявку. Наши сотрудники отдела продаж получат ваш запрос и свяжутся с вами в течение 12 часов с коммерческим предложением.