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| Фото | Номер производителя | Наличие | Количество | Технический лист | Серия | Упаковка | Состояние продукта | Тип | Количество положений или контактов (сетка) | Шаг - Сопряжение | Отделка контакта - Сопряжение | Толщина отделки контакта - Сопряжение | Материал контакта - Сопряжение | Тип крепления | Особенности | Оконечная нагрузка | Шаг - Пост | Отделка контакта - Пост | Толщина отделки контакта - Пост | Материал контакта - Пост | Материал корпуса | Рабочая температура |
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WMS-280ZCONN IC DIP SOCKET 28POS GOLD |
0 |
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Технический лист |
WMS | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame, Wash Away | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | - | -40°C ~ 105°C |
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AR06-HZW/T-RCONN IC DIP SOCKET 6POS TIN |
0 |
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Технический лист |
- | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester, Glass Filled | -40°C ~ 105°C |
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AR 20 HGL-TTSOCKET |
0 |
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- |
AR | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled | -40°C ~ 105°C |
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HLS-0103-TT-12.100" SCREW MACHINE SOCKET ARRAY |
0 |
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Технический лист |
HLS | Tube | Active | SIP | 3 (1 x 3) | 0.100" (2.54mm) | Tin | - | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | - | Thermoplastic | -55°C ~ 140°C |
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110-83-210-41-001101CONN IC DIP SOCKET 10POS GOLD |
0 |
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Технический лист |
110 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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110-87-310-41-105101CONN IC DIP SOCKET 10POS GOLD |
0 |
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Технический лист |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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DIP328-014BDIP328-014B-DIP SOCKET 28 CTS |
0 |
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Технический лист |
- | Bag | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - |
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AR28-HZL/7/07-TTCONN IC DIP SOCKET 28POS GOLD |
0 |
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Технический лист |
- | Bag | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Thermoplastic, Polyester | -40°C ~ 105°C |
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01-0503-31CONN SOCKET SIP 1POS GOLD |
0 |
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Технический лист |
0503 | Bulk | Active | SIP | 1 (1 x 1) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Gold | 30.0µin (0.76µm) | Brass | Polyamide (PA), Nylon, Glass Filled | - |
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110-87-320-41-001151CONN IC DIP SOCKET 20POS GOLD |
0 |
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- |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame, No Center Bar | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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116-87-306-41-001101CONN IC DIP SOCKET 6POS GOLD |
0 |
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Технический лист |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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A-CCS32-Z-SM-RCONN SOCKET PLCC 32POS TIN |
0 |
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Технический лист |
- | Tube | Obsolete | PLCC | 32 (2 x 7, 2 x 9) | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | -55°C ~ 105°C |
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A-CCS020-Z-SM/PSOCKET |
0 |
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- |
- | Bulk | Active | PLCC | 20 | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Polyphenylene Sulfide (PPS), Glass Filled | -40°C ~ 105°C |
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AW 127-38/Z-TSOCKET 38 CONTACTS SINGLE ROW |
0 |
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Технический лист |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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410-87-214-10-001101CONN ZIG-ZAG 14POS GOLD |
0 |
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Технический лист |
410 | Bulk | Active | Zig-Zag | 14 (2 x 7) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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410-87-214-10-002101CONN ZIG-ZAG 14POS GOLD |
0 |
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Технический лист |
410 | Bulk | Active | Zig-Zag | 14 (2 x 7) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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124-83-304-41-002101CONN IC DIP SOCKET 4POS GOLD |
0 |
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- |
124 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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116-87-610-41-006101CONN IC DIP SOCKET 10POS GOLD |
0 |
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Технический лист |
116 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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1051670001SMIA65 TOP MNT CAMERA SOCKET |
0 |
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Технический лист |
105167 | Tape & Reel (TR) | Obsolete | Camera Socket | 12 (2 x 6) | 0.037" (0.95mm) | Gold | 12.0µin (0.30µm) | Copper Alloy | Surface Mount | Open Frame | Solder | - | Gold | Flash | Copper Alloy | Thermoplastic | -55°C ~ 85°C |
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122-83-306-41-001101CONN IC DIP SOCKET 6POS GOLD |
0 |
|
Технический лист |
122 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
