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| Фото | Номер производителя | Наличие | Количество | Технический лист | Серия | Упаковка | Состояние продукта | Тип | Количество положений или контактов (сетка) | Шаг - Сопряжение | Отделка контакта - Сопряжение | Толщина отделки контакта - Сопряжение | Материал контакта - Сопряжение | Тип крепления | Особенности | Оконечная нагрузка | Шаг - Пост | Отделка контакта - Пост | Толщина отделки контакта - Пост | Материал контакта - Пост | Материал корпуса | Рабочая температура |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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06-3518-10TSOCKET W/SOLDER TAIL PINS TIM |
0 |
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- |
518 | - | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
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06-0518-10TCONN SOCKET SIP 6POS GOLD |
0 |
|
Технический лист |
518 | Bulk | Active | SIP | 6 (1 x 6) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
06-1518-10TCONN IC DIP SOCKET 6POS GOLD |
0 |
|
Технический лист |
518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
07-0518-10CONN SOCKET SIP 7POS GOLD |
0 |
|
Технический лист |
518 | Bulk | Active | SIP | 7 (1 x 7) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
|
|
AW 127-35/Z-TSOCKET 35 CONTACTS SINGLE ROW |
0 |
|
Технический лист |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
612-87-310-41-001101CONN IC DIP SOCKET 10POS GOLD |
0 |
|
Технический лист |
612 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
DIP320-001BDIP320-001B-DIP SOCKET 20 CTS |
0 |
|
Технический лист |
- | Bag | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - |
|
|
110-87-306-41-105191CONN IC DIP SOCKET 6POS GOLD |
0 |
|
- |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
116-83-304-41-001101CONN IC DIP SOCKET 4POS GOLD |
0 |
|
Технический лист |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
A-CCS032-Z-SM/PSOCKET |
0 |
|
- |
- | Bulk | Active | PLCC | 32 | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Polyphenylene Sulfide (PPS), Glass Filled | -40°C ~ 105°C |
|
110-87-316-01-822101CONN IC DIP SOCKET 16POS GOLD |
0 |
|
Технический лист |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8), 4 Loaded | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
346-93-101-41-013000CONN SOCKET SIP 1POS GOLD |
0 |
|
Технический лист |
346 | Bulk | Active | SIP | 1 (1 x 1) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
|
110-87-210-01-839101CONN IC DIP SOCKET 10POS GOLD |
0 |
|
Технический лист |
110 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 10 (2 x 5), 8 Loaded | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
510-87-020-05-001101CONN SOCKET PGA 20POS GOLD |
0 |
|
Технический лист |
510 | Bulk | Active | PGA | 20 (5 x 5) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
116-83-304-41-011101CONN IC DIP SOCKET 4POS GOLD |
0 |
|
Технический лист |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
110-87-316-41-005101CONN IC DIP SOCKET 16POS GOLD |
0 |
|
Технический лист |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
540-88-044-17-400-2CONN SOCKET PLCC 44POS TIN |
0 |
|
Технический лист |
540 | Bulk | Obsolete | PLCC | 44 (4 x 11) | 0.050" (1.27mm) | Tin | - | Phosphor Bronze | Surface Mount | Board Guide, Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Phosphor Bronze | Polyphenylene Sulfide (PPS) | - |
|
|
SIP050-1X08-160B1X08-160B-SIP SOCKET 8 CTS |
0 |
|
Технический лист |
SIP050-1x | Bulk | Active | SIP | 8 (1 x 8) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - |
|
110-83-610-41-001101CONN IC DIP SOCKET 10POS GOLD |
0 |
|
Технический лист |
110 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
|
|
AW 127-36/Z-TSOCKET 36 CONTACTS SINGLE ROW |
0 |
|
Технический лист |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
