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Радиаторы

Фото Номер производителя Наличие Цена Количество Технический лист Серия Упаковка Состояние продукта Тип Упаковка охлаждаемая Способ крепления Форма Длина Ширина Диаметр Высота ребра Рассеивание мощности при повышении температуры Тепловое сопротивление при принудительном потоке воздуха Тепловое сопротивление при естественном Материал Отделка материала
2283B

2283B

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0
2283B

Технический лист

- Bulk Active Board Level BGA Thermal Tape, Adhesive (Not Included) Square, Fins 0.655" (16.64mm) 0.655" (16.64mm) - 0.265" (6.73mm) 1.0W @ 40°C 17.50°C/W @ 300 LFM - Aluminum Black Anodized
373024B00032G

373024B00032G

BGA HEAT SINK

Boyd Laconia, LLC

0

-

- Bulk Active - Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) - - - - 0.350" (8.89mm) 1.5W @ 50°C 10.00°C/W @ 200 LFM 33.30°C/W Aluminum Black Anodized
373024B00034G

373024B00034G

BGA HEAT SINK

Boyd Laconia, LLC

0

-

- Bulk Active - Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) - - - - 0.350" (8.89mm) 1.5W @ 50°C 10.00°C/W @ 200 LFM 33.30°C/W Aluminum Black Anodized
580100W00000G

580100W00000G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0
580100W00000G

Технический лист

- Bulk Active Top Mount 8-DIP Press Fit, Slide On Rectangular, Fins 0.562" (14.27mm) 0.600" (15.24mm) - 0.450" (11.43mm) 1.0W @ 30°C 8.00°C/W @ 500 LFM 30.00°C/W Aluminum Black Anodized
374824B00035G

374824B00035G

BGA HEAT SINK

Boyd Laconia, LLC

0
374824B00035G

Технический лист

- Bulk Active - Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) - - - - 0.984" (25.00mm) 2.0W @ 30°C 5.00°C/W @ 200 LFM 12.00°C/W Aluminum Black Anodized
6400B-P2G

6400B-P2G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0
6400B-P2G

Технический лист

- Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 2.500" (63.50mm) 1.650" (41.91mm) - 1.000" (25.40mm) 4.0W @ 20°C 1.50°C/W @ 400 LFM 2.70°C/W Aluminum Black Anodized
533302B02551G

533302B02551G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0
533302B02551G

Технический лист

- Bulk Active Board Level, Vertical TO-220 Clip and PC Pin Rectangular, Fins 2.500" (63.50mm) 1.375" (34.93mm) - 0.500" (12.70mm) 8.0W @ 60°C 2.00°C/W @ 800 LFM 8.00°C/W Aluminum Black Anodized
529701B02100G

529701B02100G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0
529701B02100G

Технический лист

- Bulk Active Board Level, Vertical TO-218 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 1.000" (25.40mm) 12.0W @ 70°C 4.00°C/W @ 200 LFM 5.50°C/W Aluminum Black Anodized
501000B00000G

501000B00000G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0
501000B00000G

Технический лист

- Bulk Active Top Mount 14-DIP and 16-DIP Thermal Tape, Adhesive (Not Included) Rectangular, Fins 0.750" (19.05mm) 0.604" (15.34mm) - 0.212" (5.39mm) 0.6W @ 40°C 60.00°C/W @ 100 LFM 60.00°C/W Aluminum Black Anodized
335214B00032G

335214B00032G

BGA HEAT SINK

Boyd Laconia, LLC

0
335214B00032G

Технический лист

- Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.390" (9.91mm) - 5.30°C/W @ 200 LFM 10.00°C/W Aluminum Black Anodized
550402B00000

550402B00000

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0
550402B00000

Технический лист

- Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular 1.675" (42.55mm) 1.000" (25.40mm) - 1.000" (25.40mm) 4.0W @ 40°C 4.00°C/W @ 300 LFM 11.20°C/W Aluminum Black Anodized
591202B03700G

591202B03700G

HEATSINK TO-220 CLIP-ON BLACK

Boyd Laconia, LLC

0
591202B03700G

Технический лист

- Bulk Active Board Level, Vertical TO-220 Clip and PC Pin Rectangular, Fins 0.600" (15.24mm) 0.500" (12.70mm) - 0.500" (12.70mm) 1.0W @ 40°C 16.00°C/W @ 200 LFM 26.80°C/W Aluminum Black Anodized
2262R

2262R

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0
2262R

Технический лист

- Bulk Active Top Mount TO-5 Bolt On Cylindrical - - 0.318" (8.07mm) ID, 0.602" (15.29mm) OD 0.250" (6.35mm) 1.6W @ 80°C 30.00°C/W @ 200 LFM - Aluminum Red Anodized
519703B00000G

519703B00000G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0
519703B00000G

Технический лист

- Bulk Active Board Level TO-3 Bolt On Rhombus 1.550" (39.37mm) 1.550" (39.37mm) - 1.500" (38.10mm) 6.0W @ 30°C 2.00°C/W @ 400 LFM 4.80°C/W Aluminum Black Anodized
575400B00000G

575400B00000G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0
575400B00000G

Технический лист

- Bulk Active Top Mount TO-92 Press Fit Rectangular, Fins 0.602" (15.29mm) - - 1.220" (31.00mm) 0.5W @ 20°C 20.00°C/W @ 200 LFM 40.00°C/W Aluminum Black Anodized
575502B00000G

575502B00000G

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0
575502B00000G

Технический лист

- Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.250" (31.75mm) 0.875" (22.22mm) - 0.250" (6.35mm) 1.5W @ 40°C 6.00°C/W @ 400 LFM 24.00°C/W Aluminum Black Anodized
374524B00032G

374524B00032G

BGA HEAT SINK

Boyd Laconia, LLC

0

-

- Bulk Active - Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) - - - - 0.984" (25.00mm) 4.0W @ 70°C 4.00°C/W @ 400 LFM 16.50°C/W Aluminum Black Anodized
529801B00000

529801B00000

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0
529801B00000

Технический лист

- Bulk Active Board Level TO-218 Bolt On Rectangular, Fins 1.500" (38.10mm) 1.650" (41.91mm) - 1.000" (25.40mm) 5.0W @ 30°C 3.00°C/W @ 200 LFM 5.00°C/W Aluminum Black Anodized
513002B00000

513002B00000

BOARD LEVEL HEAT SINK

Boyd Laconia, LLC

0
513002B00000

Технический лист

- Bulk Active Board Level TO-220 Bolt On Rectangular, Fins 1.000" (25.40mm) 1.375" (34.93mm) - 0.500" (12.70mm) 2.0W @ 30°C 4.00°C/W @ 400 LFM 13.40°C/W Aluminum Black Anodized
550102B00000

550102B00000

HEATSINK TO-220 TAB BLACK

Boyd Laconia, LLC

0
550102B00000

Технический лист

- Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.675" (42.55mm) 1.000" (25.40mm) - 1.000" (25.40mm) 1.5W @ 20°C 4.00°C/W @ 300 LFM 12.40°C/W Aluminum Black Anodized
Total 122183 Record«Prev1... 60766077607860796080608160826083...6110Next»

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