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Радиаторы

Фото Номер производителя Наличие Цена Количество Технический лист Серия Упаковка Состояние продукта Тип Упаковка охлаждаемая Способ крепления Форма Длина Ширина Диаметр Высота ребра Рассеивание мощности при повышении температуры Тепловое сопротивление при принудительном потоке воздуха Тепловое сопротивление при естественном Материал Отделка материала
625-35AB

625-35AB

HEATSINK FOR 25MM BGA

Wakefield-Vette

348
625-35AB

Технический лист

625 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.350" (8.89mm) - 13.10°C/W @ 200 LFM - Aluminum Black Anodized
657-10ABPE

657-10ABPE

HEATSINK TO-220 W/PINS BLK 1"

Wakefield-Vette

807
657-10ABPE

Технический лист

657 Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 1.000" (25.40mm) 6.0W @ 41°C 3.70°C/W @ 200 LFM - Aluminum Black Anodized
288-1ABE

288-1ABE

HEATSINK FOR TO220

Wakefield-Vette

3,312
288-1ABE

Технический лист

288 Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.250" (31.75mm) 0.875" (22.22mm) - 0.215" (5.46mm) 4.0W @ 85°C 12.00°C/W @ 600 LFM 21.20°C/W Aluminum Black Anodized
HSB32-232318

HSB32-232318

HEAT SINK, BGA, 23 X 23 X 18 MM,

Same Sky (Formerly CUI Devices)

615
HSB32-232318

Технический лист

HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 0.906" (23.00mm) 0.906" (23.00mm) - 0.709" (18.00mm) 5.9W @ 75°C 4.40°C/W @ 200 LFM 12.67°C/W Aluminum Alloy Black Anodized
628-25AB

628-25AB

HEATSINK FOR 45MM BGA

Wakefield-Vette

2,991
628-25AB

Технический лист

628 Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) - 0.250" (6.35mm) 4.5W @ 80°C 7.00°C/W @ 300 LFM - Aluminum Black Anodized
624-35AB

624-35AB

HEATSINK FOR 21MM BGA

Wakefield-Vette

5,444
624-35AB

Технический лист

624 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.350" (8.89mm) - 15.00°C/W @ 400 LFM - Aluminum Black Anodized
HSB33-272710

HSB33-272710

HEAT SINK, BGA, 27 X 27 X 10 MM,

Same Sky (Formerly CUI Devices)

1,044
HSB33-272710

Технический лист

HSB Box Active Top Mount BGA Adhesive (Not Included) Square, Pin Fins 1.063" (27.00mm) 1.063" (27.00mm) - 0.394" (10.00mm) 4.4W @ 75°C 5.30°C/W @ 200 LFM 17.22°C/W Aluminum Alloy Black Anodized
657-20ABPNE

657-20ABPNE

HEATSINK TO-220 W/PINS BLK 2"

Wakefield-Vette

1,000
657-20ABPNE

Технический лист

657 Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 2.000" (50.80mm) 6.0W @ 32°C 2.90°C/W @ 200 LFM - Aluminum Black Anodized
659-65AB

659-65AB

HEATSINK EXTRUSION 37MM

Wakefield-Vette

759
659-65AB

Технический лист

659 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 1.450" (36.83mm) 1.450" (36.83mm) - 0.650" (16.51mm) 2.0W @ 20°C 1.50°C/W @ 600 LFM - Aluminum Black Anodized
624-60AB

624-60AB

HEATSINK FOR 21MM BGA

Wakefield-Vette

521
624-60AB

Технический лист

624 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Not Included) Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.600" (15.24mm) - 1.00°C/W @ 400 LFM - Aluminum Black Anodized
625-60AB

625-60AB

HEATSINK FOR 25MM BGA

Wakefield-Vette

329
625-60AB

Технический лист

625 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.600" (15.24mm) - 8.00°C/W @ 200 LFM - Aluminum Black Anodized
628-35AB

628-35AB

HEATSINK FOR 45MM BGA

Wakefield-Vette

1,997
628-35AB

Технический лист

628 Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) - 0.350" (8.89mm) 3.0W @ 50°C 10.00°C/W @ 150 LFM - Aluminum Black Anodized
ATS-PCBT1086

ATS-PCBT1086

HEATSINK TO-220 W/TAB BLACK

Advanced Thermal Solutions Inc.

989
ATS-PCBT1086

Технический лист

- Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.250" (31.75mm) 0.875" (22.22mm) - 0.250" (6.35mm) - 9.50°C/W @ 200 LFM 22.00°C/W Aluminum Black Anodized
627-15ABPE

627-15ABPE

HEATSINK FOR TO218/TO220

Wakefield-Vette

410
627-15ABPE

Технический лист

627 Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 0.500" (12.70mm) 1.375" (34.93mm) - 1.500" (38.10mm) 6.0W @ 65°C 5.50°C/W @ 200 LFM - Aluminum Black Anodized
626-20ABPE

626-20ABPE

HEATSINK FOR TO218/TO220

Wakefield-Vette

186
626-20ABPE

Технический лист

626 Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 0.500" (12.70mm) 1.375" (34.93mm) - 2.000" (50.80mm) 6.0W @ 55°C 4.70°C/W @ 200 LFM - Aluminum Black Anodized
657-25ABPNE

657-25ABPNE

HEATSINK TO-220 W/PINS BLK 2.5"

Wakefield-Vette

970
657-25ABPNE

Технический лист

657 Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 2.500" (63.50mm) 6.0W @ 25°C 2.70°C/W @ 200 LFM - Aluminum Black Anodized
655-26AB

655-26AB

HEATSINK FOR 40MM BGA

Wakefield-Vette

3,946
655-26AB

Технический лист

655 Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Not Included) Square, Pin Fins 1.600" (40.64mm) 1.600" (40.64mm) - 0.260" (6.60mm) 5.0W @ 60°C 3.00°C/W @ 500 LFM - Aluminum Black Anodized
677-10ABPE

677-10ABPE

HEATSINK

Wakefield-Vette

1,988

-

677 Bulk Active Board Level, Vertical TO-218, TO-220, TO-247, Multiwatt Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 1.000" (25.40mm) - 3.10°C/W @ 200 LFM - Aluminum Black Anodized
HSB41-303014P

HSB41-303014P

HEAT SINK, BGA, 30 X 30 X 10 MM,

Same Sky (Formerly CUI Devices)

410
HSB41-303014P

Технический лист

HSB Box Active Top Mount BGA Push Pin Square, Pin Fins 1.181" (30.00mm) 1.181" (30.00mm) - 0.551" (14.00mm) 5.9W @ 75°C 4.30°C/W @ 200 LFM 12.63°C/W Aluminum Alloy Black Anodized
HSB39-252509P

HSB39-252509P

HEAT SINK, BGA, 25 X 25 X 9 MM,

Same Sky (Formerly CUI Devices)

341
HSB39-252509P

Технический лист

HSB Box Active Top Mount BGA Push Pin Square, Pin Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.354" (9.00mm) 4.3W @ 75°C 6.30°C/W @ 200 LFM 17.53°C/W Aluminum Alloy Black Anodized
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