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EASTECH Electronics

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EASTECH Electronics EASTECH Electronics

Радиаторы

Фото Номер производителя Наличие Цена Количество Технический лист Серия Упаковка Состояние продукта Тип Упаковка охлаждаемая Способ крепления Форма Длина Ширина Диаметр Высота ребра Рассеивание мощности при повышении температуры Тепловое сопротивление при принудительном потоке воздуха Тепловое сопротивление при естественном Материал Отделка материала
SC1148

SC1148

ACTIVE COOLER

Raspberry Pi

775

-

- Box Active - - - - - - - - - - - - -
7109DG

7109DG

TOP MOUNT HEATSINK .45" D2PAK

Boyd Laconia, LLC

5,401
7109DG

Технический лист

- Bag Active Top Mount TO-263 (D²Pak) SMD Pad Rectangular, Fins 0.763" (19.38mm) 1.000" (25.40mm) - 0.450" (11.43mm) 2.0W @ 30°C 3.00°C/W @ 300 LFM 11.00°C/W Copper Tin
BDN18-3CB/A01

BDN18-3CB/A01

HEATSINK CPU W/ADHESIVE 1.81"SQ

CTS Thermal Management Products

354
BDN18-3CB/A01

Технический лист

BDN Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Pin Fins 1.810" (45.97mm) 1.810" (45.97mm) - 0.355" (9.02mm) - 3.50°C/W @ 400 LFM 10.80°C/W Aluminum Black Anodized
901-19-2-12-2-B-0

901-19-2-12-2-B-0

HEATSINK 19X19X12MM PIN

Wakefield-Vette

2,598
901-19-2-12-2-B-0

Технический лист

901 Box Active Top Mount BGA Push Pin Square, Pin Fins 0.748" (19.00mm) 0.748" (19.00mm) - 0.457" (11.60mm) - 6.60°C/W @ 200 LFM 12.70°C/W Aluminum Black Anodized
APF19-19-06CB/A01

APF19-19-06CB/A01

HEATSINK FORGED W/ADHESIVE TAPE

CTS Thermal Management Products

839
APF19-19-06CB/A01

Технический лист

APF Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Fins 0.748" (19.00mm) 0.748" (19.00mm) - 0.250" (6.35mm) - 7.10°C/W @ 200 LFM - Aluminum Black Anodized
531002B02500G

531002B02500G

HEATSINK TO-220 W/PINS 1" TALL

Boyd Laconia, LLC

584
531002B02500G

Технический лист

- Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.375" (34.93mm) - 0.500" (12.70mm) 2.0W @ 30°C 4.00°C/W @ 400 LFM 13.40°C/W Aluminum Black Anodized
APF19-19-10CB/A01

APF19-19-10CB/A01

HEATSINK FORGED W/ADHESIVE TAPE

CTS Thermal Management Products

3,434
APF19-19-10CB/A01

Технический лист

APF Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Fins 0.748" (19.00mm) 0.748" (19.00mm) - 0.370" (9.40mm) - 5.30°C/W @ 200 LFM - Aluminum Black Anodized
ATS-54270D-C1-R0

ATS-54270D-C1-R0

HEAT SINK 27MM X 27MM X 9.5MM

Advanced Thermal Solutions Inc.

2,391
ATS-54270D-C1-R0

Технический лист

- Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Fins 1.063" (27.00mm) 1.063" (27.00mm) - 0.374" (9.50mm) - 14.10°C/W @ 200 LFM - Aluminum Black Anodized
ATS-CPX060060006-205-C2-R0

ATS-CPX060060006-205-C2-R0

HEATSINK 60X60X6MM XCUT CP

Advanced Thermal Solutions Inc.

213
ATS-CPX060060006-205-C2-R0

Технический лист

pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Push Pin Square, Fins 2.362" (60.00mm) 2.362" (60.00mm) - 0.236" (6.00mm) - 13.00°C/W @ 100 LFM - Aluminum Blue Anodized
C40-058-AE

C40-058-AE

HEATSINK FOR TO-247 TO-264

Ohmite

1,168
C40-058-AE

Технический лист

C40 Box Active Board Level, Vertical TO-247, TO-264, SOT-227 Clip and Board Mounts Rectangular, Fins 2.283" (58.00mm) 1.724" (43.79mm) - 1.260" (32.00mm) - - - Aluminum Black Anodized
ATS-P1-138-C2-R0

ATS-P1-138-C2-R0

HEATSINK 25X25X15MM L-TAB T766

Advanced Thermal Solutions Inc.

965
ATS-P1-138-C2-R0

Технический лист

pushPIN™ Bulk Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Push Pin Square, Fins 0.984" (25.00mm) 0.984" (25.00mm) - 0.590" (15.00mm) - 12.18°C/W @ 100 LFM - Aluminum Blue Anodized
BDN18-6CB/A01

BDN18-6CB/A01

HEATSINK CPU W/ADHESIVE 1.81"SQ

CTS Thermal Management Products

349
BDN18-6CB/A01

Технический лист

BDN Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Pin Fins 1.810" (45.97mm) 1.810" (45.97mm) - 0.605" (15.37mm) - 2.80°C/W @ 400 LFM 8.10°C/W Aluminum Black Anodized
ATS-TI1OP-521-C1-R1

ATS-TI1OP-521-C1-R1

HEAT SINK FOR TI MOD #TPA3130D

Advanced Thermal Solutions Inc.

9,137
ATS-TI1OP-521-C1-R1

Технический лист

- Bulk Active Top Mount - Bolt On Rectangular, Fins 1.969" (50.00mm) 0.547" (13.89mm) - 0.984" (25.00mm) - 8.50°C/W @ 200 LFM - Aluminum Black Anodized
593002B03400G

593002B03400G

HEATSINK TWISTED FIN TO-220

Boyd Laconia, LLC

7,169
593002B03400G

Технический лист

Channel 5900 Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.180" (29.97mm) 0.942" (23.93mm) - 0.500" (12.70mm) 1.0W @ 20°C 4.00°C/W @ 600 LFM 13.40°C/W Aluminum Black Anodized
532702B02500G

532702B02500G

HEATSINK TO-220 SOLDERPIN 50.8MM

Boyd Laconia, LLC

484
532702B02500G

Технический лист

- Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 2.000" (50.80mm) 1.650" (41.91mm) - 1.000" (25.40mm) 10.0W @ 50°C 2.00°C/W @ 300 LFM 4.80°C/W Aluminum Black Anodized
ATS-56001-C1-R0

ATS-56001-C1-R0

HEAT SINK 19MM X 19MM X 9MM

Advanced Thermal Solutions Inc.

2,924
ATS-56001-C1-R0

Технический лист

maxiFLOW Bulk Active Top Mount ASIC Thermal Tape, Adhesive (Included) Square, Angled Fins 0.748" (19.00mm) 0.748" (19.00mm) - 0.354" (9.00mm) - 5.30°C/W @ 200 LFM - Aluminum Black Anodized
APF30-30-13CB/A01

APF30-30-13CB/A01

HEATSINK FORGED W/ADHESIVE TAPE

CTS Thermal Management Products

403
APF30-30-13CB/A01

Технический лист

APF Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Fins 1.181" (30.00mm) 1.181" (30.00mm) - 0.500" (12.70mm) - 2.50°C/W @ 200 LFM - Aluminum Black Anodized
ATS-54150D-C1-R0

ATS-54150D-C1-R0

HEAT SINK 15MM X 15MM X 9.5MM

Advanced Thermal Solutions Inc.

1,564
ATS-54150D-C1-R0

Технический лист

- Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Fins 0.591" (15.00mm) 0.591" (15.00mm) - 0.374" (9.50mm) - 26.20°C/W @ 200 LFM - Aluminum Black Anodized
APF40-40-06CB/A01

APF40-40-06CB/A01

HEATSINK FORGED W/ADHESIVE TAPE

CTS Thermal Management Products

608
APF40-40-06CB/A01

Технический лист

APF Box Active Top Mount Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Fins 1.575" (40.00mm) 1.575" (40.00mm) - 0.250" (6.35mm) - 3.30°C/W @ 200 LFM - Aluminum Black Anodized
ATS-55170D-C1-R0

ATS-55170D-C1-R0

HEAT SINK 17MM X 17MM X 9.5MM

Advanced Thermal Solutions Inc.

2,059
ATS-55170D-C1-R0

Технический лист

- Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Fins 0.669" (17.00mm) 0.669" (17.00mm) - 0.374" (9.50mm) - 28.00°C/W @ 200 LFM - Aluminum Black Anodized
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