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Фото Номер производителя Наличие Цена Количество Технический лист Серия Упаковка Состояние продукта Тип Упаковка охлаждаемая Способ крепления Форма Длина Ширина Диаметр Высота ребра Рассеивание мощности при повышении температуры Тепловое сопротивление при принудительном потоке воздуха Тепловое сопротивление при естественном Материал Отделка материала
513102B02500G

513102B02500G

HEATSINK TO-220 W/PINS 1.5"TALL

Boyd Laconia, LLC

4,060
513102B02500G

Технический лист

- Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.500" (38.10mm) 1.375" (34.93mm) - 0.500" (12.70mm) 8.0W @ 80°C 3.00°C/W @ 500 LFM 11.00°C/W Aluminum Black Anodized
3083

3083

ALUM HEAT SINK FOR RASPBERRY PI

Adafruit Industries LLC

2,534
3083

Технический лист

- Bulk Active Top Mount Raspberry Pi 3 Thermal Tape, Adhesive (Included) Square, Fins 0.551" (14.00mm) 0.551" (14.00mm) - 0.315" (8.00mm) - - - Aluminum -
LTN20069

LTN20069

HEAT SINK BGA/PGA 16.5X16.5X8.9

Wakefield-Vette

5,849
LTN20069

Технический лист

Penguin Bulk Active Board Level Assorted (BGA, LGA, CPU, ASIC...) Thermal Tape, Adhesive (Included) Square, Fins 0.650" (16.51mm) 0.653" (16.59mm) - 0.350" (8.89mm) - 8.00°C/W @ 500 LFM - Aluminum Black Anodized
513201B02500G

513201B02500G

HEATSINK TO-218/TO-247 W/PINS 2"

Boyd Laconia, LLC

1,697
513201B02500G

Технический лист

- Bulk Active Board Level, Vertical TO-218 Bolt On and PC Pin Rectangular, Fins 2.000" (50.80mm) 1.375" (34.93mm) - 0.500" (12.70mm) 2.0W @ 20°C 3.00°C/W @ 400 LFM 8.30°C/W Aluminum Black Anodized
637-10ABPE

637-10ABPE

HEATSINK TO-220 VERT MT BLK 1"

Wakefield-Vette

2,170
637-10ABPE

Технический лист

637 Box Active Board Level, Vertical TO-220 Bolt On and Board Mounts Rectangular, Fins 1.000" (25.40mm) 1.375" (34.93mm) - 0.500" (12.70mm) 6.0W @ 76°C 5.80°C/W @ 200 LFM - Aluminum Black Anodized
V-1102-SMD/A-L

V-1102-SMD/A-L

HEATSINK TO-263 19.38X25.40MM

Assmann WSW Components

4,655
V-1102-SMD/A-L

Технический лист

- Bulk Active Top Mount TO-263 (D²Pak) SMD Pad Rectangular, Fins 0.763" (19.38mm) 1.000" (25.40mm) - 0.450" (11.43mm) - 23.00°C/W @ 300 LFM 11.00°C/W Copper Tin
DV-T263-201E-TR

DV-T263-201E-TR

HEATSINK FOR TO-263

Ohmite

10,676
DV-T263-201E-TR

Технический лист

D Tape & Reel (TR) Active Top Mount TO-263 (D²Pak) Solderable Feet Rectangular, Fins 0.500" (12.70mm) 1.020" (25.91mm) - 0.480" (12.19mm) 2.0W @ 30°C 8.00°C/W @ 500 LFM - Aluminum Degreased
6025DG

6025DG

HEATSINK TO-220 STAGGEREDFIN TIN

Boyd Laconia, LLC

8,081
6025DG

Технический лист

- Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.250" (31.75mm) 0.875" (22.23mm) - 0.250" (6.35mm) 3.0W @ 60°C 7.00°C/W @ 400 LFM 17.90°C/W Copper Tin
TGH-0075-01

TGH-0075-01

ALUMINIUM HEAT SINK 7.5X7.5MM

t-Global Technology

747
TGH-0075-01

Технический лист

TGH Bulk Active Top Mount - - Square, Fins 0.295" (7.50mm) 0.295" (7.50mm) - 0.394" (10.00mm) - - - Aluminum Clean Anodized
V5618A

V5618A

HEATSINK ALUM ANOD

Assmann WSW Components

24,969
V5618A

Технический лист

- Bulk Active Top Mount 6-Dip and 8-Dip Press Fit Rectangular, Fins 0.334" (8.50mm) 0.250" (6.35mm) - 0.189" (4.80mm) - - 80.00°C/W Aluminum Black Anodized
375424B00034G

375424B00034G

HEATSINK PIN-FIN W/TAPE

Boyd Laconia, LLC

2,277
375424B00034G

Технический лист

- Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 0.598" (15.19mm) 0.598" (15.19mm) - 0.252" (6.40mm) - 17.60°C/W @ 200 LFM 62.50°C/W Aluminum Black Anodized
3082

3082

ALUM HEATSINK FOR RASPBERRY PI

Adafruit Industries LLC

1,139
3082

Технический лист

- Bulk Active Top Mount Raspberry Pi 3 Thermal Tape, Adhesive (Included) Square, Fins 0.591" (15.00mm) 0.591" (15.00mm) - 0.590" (15.00mm) - - - Aluminum -
110991328

110991328

HEAT SINK KIT FOR RASPBERRY PI 4

Seeed Technology Co., Ltd

2,602
110991328

Технический лист

- Bulk Active Top Mount Kit Raspberry Pi 4B Adhesive - - - - - - - - Aluminum -
374024B00035G

374024B00035G

HEATSINK BGA 23X23X10MM W/ADH

Boyd Laconia, LLC

1,892
374024B00035G

Технический лист

- Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 0.906" (23.01mm) 0.906" (23.01mm) - 0.394" (10.00mm) 1.0W @ 40°C 11.70°C/W @ 200 LFM 40.00°C/W Aluminum Black Anodized
529702B02500G

529702B02500G

BOARD LEVEL HEATSINK 1" TO-220

Boyd Laconia, LLC

2,157
529702B02500G

Технический лист

- Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 1.000" (25.40mm) 4.0W @ 30°C 4.00°C/W @ 200 LFM 5.50°C/W Aluminum Black Anodized
657-20ABEP

657-20ABEP

HEATSINK TO-220 W/PINS BLK 2"

Wakefield-Vette

9,777
657-20ABEP

Технический лист

657 Bulk Active Board Level, Vertical TO-218, TO-220, TO-247 Bolt On and PC Pin Rectangular, Fins 1.000" (25.40mm) 1.650" (41.91mm) - 2.000" (50.80mm) 6.0W @ 32°C 2.90°C/W @ 200 LFM 5.30°C/W Aluminum Black Anodized
647-15ABPE

647-15ABPE

HEATSINK TO-220 W/PINS BLK 1.5"

Wakefield-Vette

3,550
647-15ABPE

Технический лист

647 Bulk Active Board Level, Vertical TO-220 Bolt On and PC Pin Rectangular, Fins 1.500" (38.10mm) 1.650" (41.91mm) - 1.000" (25.40mm) 6.0W @ 37°C 3.50°C/W @ 200 LFM - Aluminum Black Anodized
7109D/TRG

7109D/TRG

HEATSINK TO-263 (D2PK)

Boyd Laconia, LLC

9,031
7109D/TRG

Технический лист

- Tape & Reel (TR) Active Top Mount TO-263 (D²Pak) SMD Pad Rectangular, Fins 0.763" (19.38mm) 1.000" (25.40mm) - 0.450" (11.43mm) 2.0W @ 30°C 3.00°C/W @ 300 LFM 11.00°C/W Copper Tin
624-25ABT4E

624-25ABT4E

HEATSINK CPU 21MM SQ W/DBL TAPE

Wakefield-Vette

1,017
624-25ABT4E

Технический лист

624 Bulk Active Top Mount BGA Thermal Tape, Adhesive (Included) Square, Pin Fins 0.827" (21.00mm) 0.827" (21.00mm) - 0.250" (6.35mm) - 25.00°C/W @ 200 LFM - Aluminum Black Anodized
DV-T263-101E-TR

DV-T263-101E-TR

TO-263 HEAT SINK / POLY TAPE

Ohmite

2,480
DV-T263-101E-TR

Технический лист

D Tape & Reel (TR) Active Top Mount TO-263 (D²Pak) Solderable Feet Rectangular, Fins 0.500" (12.70mm) 1.020" (25.91mm) - 0.400" (10.16mm) 2.0W @ 30°C 8.00°C/W @ 500 LFM - Aluminum Degreased
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