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| Фото | Номер производителя | Наличие | Количество | Технический лист | Серия | Упаковка | Состояние продукта | Тип | Количество положений или контактов (сетка) | Шаг - Сопряжение | Отделка контакта - Сопряжение | Толщина отделки контакта - Сопряжение | Материал контакта - Сопряжение | Тип крепления | Особенности | Оконечная нагрузка | Шаг - Пост | Отделка контакта - Пост | Толщина отделки контакта - Пост | Материал контакта - Пост | Материал корпуса | Рабочая температура |
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110-13-642-41-001000CONN IC DIP SOCKET 42POS GOLD |
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Технический лист |
110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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132-PGM14015-10CONN SOCKET PGA GOLD |
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Технический лист |
PGM | Bulk | Active | PGA | - | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 105°C |
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116-47-952-41-006000STANDRD SOLDRTL |
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Технический лист |
116 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 52 (2 x 26) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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714-43-232-31-018000CONN IC DIP SOCKET 32POS GOLD |
0 |
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Технический лист |
714 | Bulk | Active | DIP, 0.1" (2.54mm) Row Spacing | 32 (2 x 16) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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APH-1340-T-TAPH-1340-T-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0840-T-TAPH-0840-T-T |
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APH-0440-T-TAPH-0440-T-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0940-T-TAPH-0940-T-T |
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APH-1440-T-TAPH-1440-T-T |
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APH-1940-T-TAPH-1940-T-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0540-T-TAPH-0540-T-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1040-T-TAPH-1040-T-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0740-T-TAPH-0740-T-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0240-T-TAPH-0240-T-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0640-T-TAPH-0640-T-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1640-T-TAPH-1640-T-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1140-T-TAPH-1140-T-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0340-T-TAPH-0340-T-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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24-526-11CONN IC DIP SOCKET ZIF 24POS GLD |
0 |
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Технический лист |
Lo-PRO®file, 526 | Bulk | Active | DIP, ZIF (ZIP) | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyamide (PA46), Nylon 4/6, Glass Filled | -55°C ~ 125°C |
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612-41-328-41-004000SKT CARRIER SOLDRTL |
0 |
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Технический лист |
612 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
