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| Фото | Номер производителя | Наличие | Количество | Технический лист | Серия | Упаковка | Состояние продукта | Тип | Количество положений или контактов (сетка) | Шаг - Сопряжение | Отделка контакта - Сопряжение | Толщина отделки контакта - Сопряжение | Материал контакта - Сопряжение | Тип крепления | Особенности | Оконечная нагрузка | Шаг - Пост | Отделка контакта - Пост | Толщина отделки контакта - Пост | Материал контакта - Пост | Материал корпуса | Рабочая температура |
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116-91-650-41-006000CONN IC SKT DBL |
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Технический лист |
116 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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APH-0838-T-TAPH-0838-T-T |
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APH-1338-T-TAPH-1338-T-T |
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APH-1438-T-TAPH-1438-T-T |
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APH-1838-T-TAPH-1838-T-T |
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APH-0538-T-TAPH-0538-T-T |
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APH-1938-T-TAPH-1938-T-T |
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APH-0938-T-TAPH-0938-T-T |
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APH-1538-T-TAPH-1538-T-T |
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APH-1038-T-TAPH-1038-T-T |
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APH-0638-T-TAPH-0638-T-T |
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APH-1138-T-TAPH-1138-T-T |
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APH-0338-T-TAPH-0338-T-T |
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APH-1238-T-TAPH-1238-T-T |
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APH-1638-T-TAPH-1638-T-T |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0738-T-TAPH-0738-T-T |
0 |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0238-T-TAPH-0238-T-T |
0 |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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44-3551-10CONN IC DIP SOCKET ZIF 44POS TIN |
0 |
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Технический лист |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 44 (2 x 22) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
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44-3552-10CONN IC DIP SOCKET ZIF 44POS TIN |
0 |
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Технический лист |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 44 (2 x 22) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
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44-3553-10CONN IC DIP SOCKET ZIF 44POS TIN |
0 |
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Технический лист |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 44 (2 x 22) | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
