Пожалуйста, свяжитесь с нами для получения актуальной информации о ценах и наличии товара.

Гнезда для ИС

Фото Номер производителя Наличие Цена Количество Технический лист Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура
510-87-064-08-000101

510-87-064-08-000101

CONN SOCKET PGA 64POS GOLD

Preci-Dip

0
510-87-064-08-000101

Технический лист

510 Bulk Active PGA 64 (8 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-83-328-41-117101

114-83-328-41-117101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0
114-83-328-41-117101

Технический лист

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
114-83-328-41-134161

114-83-328-41-134161

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0
114-83-328-41-134161

Технический лист

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
07-0508-20

07-0508-20

CONN SOCKET SIP 7POS GOLD

Aries Electronics

0
07-0508-20

Технический лист

508 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
07-0508-30

07-0508-30

CONN SOCKET SIP 7POS GOLD

Aries Electronics

0
07-0508-30

Технический лист

508 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
AJ 64-HZL-T

AJ 64-HZL-T

SOCKET

Assmann WSW Components

0

-

- Bulk Active DIP, 0.75" (19.05mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 196.9µin (5.00µm) Brass Polyphenylene Sulfide (PPS) -40°C ~ 105°C
110-83-628-41-005101

110-83-628-41-005101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0
110-83-628-41-005101

Технический лист

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
110-83-628-41-605101

110-83-628-41-605101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0
110-83-628-41-605101

Технический лист

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
215-1-14-003

215-1-14-003

CONN IC DIP SOCKET 14POS GOLD

CNC Tech

0
215-1-14-003

Технический лист

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -55°C ~ 105°C
HLS-0203-T-11

HLS-0203-T-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
HLS-0203-T-11

Технический лист

HLS Tube Active SIP 6 (2 x 3) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
BU240Z-178-HT

BU240Z-178-HT

CONN IC DIP SOCKET 24POS GOLD

On Shore Technology Inc.

0
BU240Z-178-HT

Технический лист

BU-178HT Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 78.7µin (2.00µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Copper Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
116-87-420-41-008101

116-87-420-41-008101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0
116-87-420-41-008101

Технический лист

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
ICO-316-STT-L

ICO-316-STT-L

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0
ICO-316-STT-L

Технический лист

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
116-83-322-41-003101

116-83-322-41-003101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0
116-83-322-41-003101

Технический лист

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
116-83-314-41-011101

116-83-314-41-011101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0
116-83-314-41-011101

Технический лист

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
115-87-642-41-001101

115-87-642-41-001101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

0

-

115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
18-0513-10H

18-0513-10H

CONN SOCKET SIP 18POS GOLD

Aries Electronics

0
18-0513-10H

Технический лист

0513 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
20-0518-11

20-0518-11

CONN SOCKET SIP 20POS GOLD

Aries Electronics

0
20-0518-11

Технический лист

518 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
510-87-069-11-001101

510-87-069-11-001101

CONN SOCKET PGA 69POS GOLD

Preci-Dip

0
510-87-069-11-001101

Технический лист

510 Bulk Active PGA 69 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
HLS-0107-T-10

HLS-0107-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
HLS-0107-T-10

Технический лист

HLS Tube Active SIP 7 (1 x 7) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
Total 19086 Record«Prev1... 184185186187188189190191...955Next»

Начать сейчас!

Получайте последние новости

EASTECH Electronics

Главная

EASTECH Electronics

Поиск

EASTECH Electronics

Продукты

EASTECH Electronics

Whatsapp

Отправка...
×
Отправлено успешно!
Спасибо за вашу заявку. Наши сотрудники отдела продаж получат ваш запрос и свяжутся с вами в течение 12 часов с коммерческим предложением.