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Управление питанием - специализированное
| Фото | Номер производителя | Наличие | Количество | Технический лист | Серия | Корпус/корпус | Упаковка | Состояние продукта | Применение | Ток - Питание | Напряжение - Питание | Рабочая температура | Марка | Квалификация | Тип крепления | Устройство поставщика Упаковка |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MC33VR5500V3ESR2VR5500 |
0 |
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- |
* | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - |
|
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MC33VR5500V2ESR2VR5500 |
0 |
|
- |
* | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - |
|
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MC33VR5500V1ESR2VR5500 |
0 |
|
Технический лист |
* | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - |
|
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MC33VR5500V0ESR2VR5500 |
0 |
|
Технический лист |
* | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - |
|
UC29432DTRG4IC ANLG CTRLR ADJ 8SOIC |
0 |
|
Технический лист |
- | 8-SOIC (0.154", 3.90mm Width) | Tape & Reel (TR) | Discontinued | Overvoltage Comparator, Optocoupler | 500µA | 2.2V ~ 24V | -25°C ~ 85°C | - | - | Surface Mount | 8-SOIC |
|
|
MC35FS6506NAESYSTEM BASIS CHIP, DCDC 0.8A VCO |
0 |
|
Технический лист |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
|
MC35FS4501NAEFS4500 |
0 |
|
Технический лист |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
LTC3331IUH#TRPBFIC REG BUCK/LDO SYNC 50MA 32QFN |
0 |
|
Технический лист |
- | 32-WFQFN Exposed Pad | Tape & Reel (TR) | Active | Energy Harvesting | 950nA | 1.8V ~ 5.5V, 3V ~ 19V | -40°C ~ 125°C | - | - | Surface Mount | 32-QFN (5x5) |
|
MVR5510AVMA6EPR2IC PMIC VR5510 QM |
0 |
|
- |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | - | 15mA | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
|
MVR5510AVMA0EPR2IC PMIC VR5510 QM |
0 |
|
- |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | - | 15mA | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
|
MVR5510AVMA4EPR2IC PMIC VR5510 QM |
0 |
|
- |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | - | 15mA | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
|
MVR5510AVMAHEPR2IC PMIC VR5510 QM |
0 |
|
- |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | - | 15mA | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8100CCESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 |
|
Технический лист |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
|
MC33PF8100EPESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 |
|
Технический лист |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
|
MC33PF8100CFESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 |
|
Технический лист |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
|
MC33PF8100EQESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 |
|
Технический лист |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
|
MC33PF8100EAESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 |
|
Технический лист |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
|
MC33PF8100ERESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 |
|
Технический лист |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
|
MC33PF8100CHESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 |
|
Технический лист |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
|
MC33PF8100A0ESR2POWER MANAGEMENT IC I.MX8 NON-PR |
0 |
|
Технический лист |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
