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Управление питанием - специализированное

Фото Номер производителя Наличие Цена Количество Технический лист Серия Корпус/корпус Упаковка Состояние продукта Применение Ток - Питание Напряжение - Питание Рабочая температура Марка Квалификация Тип крепления Устройство поставщика Упаковка
MFS8613BMDA0ESR2

MFS8613BMDA0ESR2

SAFETY SYSTEM BASIS CHIP FOR DOM

NXP USA Inc.

0
MFS8613BMDA0ESR2

Технический лист

- 48-VFQFN Exposed Pad Tape & Reel (TR) Active Camera - 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 48-HVQFN (7x7)
MC33FS6511CAE

MC33FS6511CAE

SYSTEM BASIS CHIP DCDC 1.5A VCO

NXP USA Inc.

0
MC33FS6511CAE

Технический лист

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C - - Surface Mount 48-HLQFP (7x7)
MC35FS6506CAER2

MC35FS6506CAER2

SYSTEM BASIS CHIP, DCDC 0.8A VCO

NXP USA Inc.

0
MC35FS6506CAER2

Технический лист

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MAX20846BAAFT+T

MAX20846BAAFT+T

COMMON FOOT PRINT 4 X 6 POWER ST

Analog Devices Inc./Maxim Integrated

0

-

- - Tape & Reel (TR) Active - - - - - - - -
MAX20846ABAFT+T

MAX20846ABAFT+T

COMMON FOOT PRINT 4 X 6 POWER ST

Analog Devices Inc./Maxim Integrated

0

-

- - Tape & Reel (TR) Active - - - - - - - -
MAX20846AAAFT+T

MAX20846AAAFT+T

COMMON FOOT PRINT 4 X 6 POWER ST

Analog Devices Inc./Maxim Integrated

0

-

- - Tape & Reel (TR) Active - - - - - - - -
MC35FS4506NAE

MC35FS4506NAE

SYSTEM BASIS CHIP, LINEAR 0.5A V

NXP USA Inc.

0
MC35FS4506NAE

Технический лист

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
LTC3588IDD-1#TRPBF

LTC3588IDD-1#TRPBF

IC ENERGY HARVESTING PSU 10DFN

Analog Devices Inc.

0
LTC3588IDD-1#TRPBF

Технический лист

- 10-WFDFN Exposed Pad Tape & Reel (TR) Active Energy Harvesting 950nA 2.7V ~ 20V -40°C ~ 125°C - - Surface Mount 10-DFN (3x3)
LTC3588IMSE-1#TRPBF

LTC3588IMSE-1#TRPBF

IC ENERGY HARVESTING PSU 10MSOP

Analog Devices Inc.

0
LTC3588IMSE-1#TRPBF

Технический лист

- 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad Tape & Reel (TR) Active Energy Harvesting 950nA 2.7V ~ 20V -40°C ~ 125°C - - Surface Mount 10-MSOP-EP
MC33FS8415GJKSR2

MC33FS8415GJKSR2

SAFETY POWER MANAGEMENT IC, QFN5

NXP USA Inc.

0
MC33FS8415GJKSR2

Технический лист

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active System Basis Chip 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33FS8415GYKSR2

MC33FS8415GYKSR2

SAFETY POWER MANAGEMENT IC, QFN5

NXP USA Inc.

0
MC33FS8415GYKSR2

Технический лист

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active System Basis Chip 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33FS8415GYESR2

MC33FS8415GYESR2

SAFETY POWER MANAGEMENT IC, QFN5

NXP USA Inc.

0
MC33FS8415GYESR2

Технический лист

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active System Basis Chip 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33FS8415G0KSR2

MC33FS8415G0KSR2

SAFETY POWER MANAGEMENT IC, QFN5

NXP USA Inc.

0
MC33FS8415G0KSR2

Технический лист

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active System Basis Chip 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33FS8415G0ESR2

MC33FS8415G0ESR2

SAFETY POWER MANAGEMENT IC, QFN5

NXP USA Inc.

0
MC33FS8415G0ESR2

Технический лист

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active System Basis Chip 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33FS8415GJESR2

MC33FS8415GJESR2

SAFETY POWER MANAGEMENT IC, QFN5

NXP USA Inc.

0
MC33FS8415GJESR2

Технический лист

- 56-VFQFN Exposed Pad Tape & Reel (TR) Active System Basis Chip 15mA 60V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount, Wettable Flank 56-HVQFN (8x8)
MC33FS6507CAE

MC33FS6507CAE

SYSTEM BASIS CHIP, DCDC 0.8A VCO

NXP USA Inc.

0
MC33FS6507CAE

Технический лист

- 48-LQFP Exposed Pad Tray Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33FS6527LAER2

MC33FS6527LAER2

SYSTEM BASIS CHIP, DCDC 2.2A VCO

NXP USA Inc.

0
MC33FS6527LAER2

Технический лист

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33FS6528NAER2

MC33FS6528NAER2

SYSTEM BASIS CHIP, DCDC 2.2A VCO

NXP USA Inc.

0
MC33FS6528NAER2

Технический лист

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 125°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC35FS6502NAER2

MC35FS6502NAER2

FS6500

NXP USA Inc.

0
MC35FS6502NAER2

Технический лист

- 48-LQFP Exposed Pad Tape & Reel (TR) Active System Basis Chip - 1V ~ 5V -40°C ~ 150°C (TA) Automotive AEC-Q100 Surface Mount 48-HLQFP (7x7)
MC33PF8100CGES

MC33PF8100CGES

IC POWER MANAGEMENT I.MX8QM

NXP USA Inc.

0
MC33PF8100CGES

Технический лист

- 56-VFQFN Exposed Pad Tray Obsolete High Performance i.MX 8, S32x Processor Based - 2.5V ~ 5.5V -40°C ~ 105°C (TA) - - Surface Mount, Wettable Flank 56-HVQFN (8x8)
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