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Радиаторы

Номер производителя	Наличие	Цена	Количество	Технический лист	Серия	Упаковка	Состояние продукта	Тип	Упаковка охлаждаемая	Способ крепления	Форма	Длина	Ширина	Диаметр	Высота ребра	Рассеивание мощности при повышении температуры	Тепловое сопротивление при принудительном потоке воздуха	Тепловое сопротивление при естественном	Материал	Отделка материала
M47059B011000G MAX CLIP HEATSINK Boyd Laconia, LLC	896	-	Запрос цены	Технический лист	Max Clip System™	Bulk	Active	Board Level, Vertical	TO-126, TO-220, TO-247	Clip and PC Pin	Rectangular, Angled Fins	0.591" (15.00mm)	0.764" (19.40mm)	-	1.240" (31.50mm)	-	-	-	Aluminum	Black Anodized
V2030A HEATSINK CPU FORGED Assmann WSW Components	1,715	-	Запрос цены	Технический лист	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.256" (6.50mm)	-	-	6.50°C/W	Aluminum Alloy	Clean Finished
591202B00000G HEATSINK TO-220 VERT/HORZ MOUNT Boyd Laconia, LLC	3,034	-	Запрос цены	Технический лист	-	Bag	Active	Board Level	TO-220, TO-262	Clip	Rectangular, Fins	0.600" (15.24mm)	0.500" (12.70mm)	-	0.500" (12.70mm)	1.0W @ 40°C	16.00°C/W @ 200 LFM	26.80°C/W	Aluminum	Black Anodized
311505B00000G TO-5 PUSH-ON HEATSINK Boyd Laconia, LLC	336	-	Запрос цены	Технический лист	-	Bulk	Active	Board Level	TO-5	Press Fit	Cylindrical	-	-	0.317" (8.05mm) ID, 0.375" (9.52mm) OD	0.400" (10.16mm)	1.0W @ 70°C	45.00°C/W @ 200 LFM	90.00°C/W	Aluminum	Black Anodized
574902B00000G HEATSINK TO-220 CLIP-ON Boyd Laconia, LLC	1,302	-	Запрос цены	Технический лист	-	Bulk	Active	Board Level	TO-220	Clip	Rectangular, Fins	1.375" (34.93mm)	0.860" (21.84mm)	-	0.395" (10.03mm)	2.5W @ 40°C	6.00°C/W @ 400 LFM	16.00°C/W	Aluminum	Black Anodized
658-25ABT1E HEATSINK CPU 28MM SQ BLK W/TAPE Wakefield-Vette	2,111	-	Запрос цены	Технический лист	658	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	-	0.250" (6.35mm)	2.0W @ 40°C	5.00°C/W @ 500 LFM	-	Aluminum	Black Anodized
M47079B011000G MAX CLIP HEATSINK Boyd Laconia, LLC	546	-	Запрос цены	Технический лист	Max Clip System™	Bulk	Active	Board Level, Vertical	TO-126, TO-220, TO-247	Clip and PC Pin	Rectangular, Angled Fins	0.790" (20.07mm)	0.764" (19.40mm)	-	1.240" (31.50mm)	-	-	-	Aluminum	Black Anodized
7021B-MTG HEATSINK TO-220 TAB FOLD 42.16MM Boyd Laconia, LLC	6,795	-	Запрос цены	Технический лист	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.450" (36.83mm)	1.750" (44.45mm)	-	0.380" (9.65mm)	6.0W @ 50°C	4.00°C/W @ 300 LFM	6.80°C/W	Aluminum	Black Anodized
7-339-3PP-BA HEATSINK PWR W/PINS BLACK TO-220 CTS Thermal Management Products	3,395	-	Запрос цены	Технический лист	7	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	2.000" (50.80mm)	1.650" (41.91mm)	-	1.000" (25.40mm)	6.0W @ 40°C	-	7.00°C/W	Aluminum	Black Anodized
TGH-0250-01 ALUMINIUM HEAT SINK 25X25MM t-Global Technology	143	-	Запрос цены	Технический лист	TGH	Bulk	Active	Top Mount	-	-	Square, Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.354" (9.00mm)	-	-	-	Aluminum	-
TGH-0300-04 ALUMINIUM HEAT SINK 30X30MM t-Global Technology	105	-	Запрос цены	Технический лист	TGH	Bulk	Active	Top Mount	-	-	Square, Fins	1.181" (30.00mm)	1.181" (30.00mm)	-	0.591" (15.01mm)	-	-	-	Aluminum	-
HSE08-505028 HEAT SINK, EXTRUSION, TO-218/TO- Same Sky (Formerly CUI Devices)	699	-	Запрос цены	Технический лист	HSE	Bag	Active	Board Level	TO-218, TO-220	Clip	Rectangular, Angled Fins	1.969" (50.00mm)	1.102" (28.00mm)	-	1.969" (50.00mm)	10.53W @ 75°C	2.70°C/W @ 200 LFM	7.13°C/W	Aluminum Alloy	Black Anodized
V2032N HEATSINK CPU FORGED Assmann WSW Components	1,396	-	Запрос цены	Технический лист	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.728" (18.50mm)	-	-	5.00°C/W	Aluminum Alloy	Natural Anodized
ATS-FPX054054013-17-C1-R0 HEATSINK 54X54X12.7MM XCUT FP Advanced Thermal Solutions Inc.	3,899	-	Запрос цены	Технический лист	pushPIN™	Tray	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Push Pin	Square, Fins	2.126" (54.00mm)	2.126" (54.00mm)	-	0.500" (12.70mm)	-	15.42°C/W @ 100 LFM	-	Aluminum	Blue Anodized
658-35ABT3 HEATSINK CPU 28MM SQ BLK W/TAPE Wakefield-Vette	1,023	-	Запрос цены	Технический лист	658	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	-	0.350" (8.89mm)	-	3.00°C/W @ 800 LFM	-	Aluminum	Black Anodized
V2276E1 CPU HEATSINK, CROSS CUT, AL6063, Assmann WSW Components	345	-	Запрос цены	Технический лист	-	Bulk	Active	Top Mount	-	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.063" (27.00mm)	1.063" (27.00mm)	-	0.984" (25.00mm)	-	-	19.50°C/W	Aluminum Alloy	Black Anodized
V4330F HEATSINK ALUM ANOD Assmann WSW Components	236	-	Запрос цены	Технический лист	-	Bulk	Active	Board Level	KLP	Bolt On	Rectangular, Fins	1.969" (50.00mm)	1.142" (29.00mm)	-	0.453" (11.50mm)	-	-	10.00°C/W	Aluminum	Black Anodized
577002B04000G HEATSINK TO-220 W/TAB .25 Boyd Laconia, LLC	1,060	-	Запрос цены	Технический лист	-	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	0.750" (19.05mm)	0.520" (13.21mm)	-	0.250" (6.35mm)	1.5W @ 50°C	16.00°C/W @ 200 LFM	32.00°C/W	Aluminum	Black Anodized
HSE07-753045 HEAT SINK, EXTRUSION, TO-218/TO- Same Sky (Formerly CUI Devices)	935	-	Запрос цены	Технический лист	HSE	Bag	Active	Board Level	TO-218, TO-220	Clip	Rectangular, Fins	2.953" (75.00mm)	1.181" (30.00mm)	-	1.772" (45.00mm)	15.46W @ 75°C	2.10°C/W @ 200 LFM	4.85°C/W	Aluminum Alloy	Black Anodized
HSE09-755028 HEAT SINK, EXTRUSION, TO-218/TO- Same Sky (Formerly CUI Devices)	965	-	Запрос цены	Технический лист	HSE	Bag	Active	Board Level	TO-218, TO-220	Clip	Rectangular, Angled Fins	2.953" (75.00mm)	1.102" (28.00mm)	-	1.969" (50.00mm)	13.26W @ 75°C	2.50°C/W @ 200 LFM	5.66°C/W	Aluminum Alloy	Black Anodized