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Радиаторы

Номер производителя	Наличие	Цена	Количество	Технический лист	Серия	Упаковка	Состояние продукта	Тип	Упаковка охлаждаемая	Способ крепления	Форма	Длина	Ширина	Диаметр	Высота ребра	Рассеивание мощности при повышении температуры	Тепловое сопротивление при принудительном потоке воздуха	Тепловое сопротивление при естественном	Материал	Отделка материала
530714B00000G HEATSINK TO-220 LIGHTWEIGHT .5" Boyd Laconia, LLC	1,484	-	Запрос цены	Технический лист	-	Bag	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	0.710" (18.03mm)	1.000" (25.40mm)	-	0.500" (12.70mm)	2.0W @ 40°C	4.00°C/W @ 700 LFM	20.30°C/W	Aluminum	Black Anodized
HSB30-373710 HEAT SINK, BGA, 37.4 X 37 X 10 M Same Sky (Formerly CUI Devices)	172	-	Запрос цены	Технический лист	HSB	Box	Active	Top Mount	BGA	Push Pin	Square, Pin Fins	1.472" (37.39mm)	1.472" (37.39mm)	-	0.394" (10.00mm)	6.45W @ 75°C	4°C/W @ 200 LFM	11.63°C/W	Aluminum Alloy	Black Anodized
655-53AB HEATSINK CPU 40.6MM SQ H=.525" Wakefield-Vette	3,411	-	Запрос цены	Технический лист	655	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	1.600" (40.64mm)	1.600" (40.64mm)	-	0.522" (13.27mm)	4.0W @ 40°C	2.00°C/W @ 400 LFM	-	Aluminum	Black Anodized
V2030B HEATSINK CPU FORGED Assmann WSW Components	564	-	Запрос цены	Технический лист	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	Thermal Tape, Adhesive (Not Included)	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.256" (6.50mm)	-	-	6.00°C/W	Aluminum Alloy	Black Anodized
DV-T268-301E-TR HEATSINK FOR TO-268 Ohmite	3,971	-	Запрос цены	Технический лист	D	Tape & Reel (TR)	Active	Top Mount	TO-268 (D³Pak)	Solderable Feet	Rectangular, Fins	0.500" (12.70mm)	1.580" (40.13mm)	-	0.460" (11.68mm)	7.0W @ 35°C	4.00°C/W @ 700 LFM	-	Aluminum	Degreased
504222B00000G HEATSINK TO-220 PWR CLR 1.45"10W Boyd Laconia, LLC	2,583	-	Запрос цены	Технический лист	-	Bag	Active	Board Level	TO-220 (Dual)	Bolt On	Rectangular, Fins	1.450" (36.83mm)	0.780" (19.81mm)	-	0.850" (21.60mm)	4.0W @ 40°C	5.00°C/W @ 200 LFM	6.40°C/W	Aluminum	Black Anodized
M48118B011000G MAX CLIP HEATSINK Boyd Laconia, LLC	6,174	-	Запрос цены	Технический лист	Max Clip System™	Bulk	Active	Board Level, Vertical	TO-126, TO-220, TO-247	Clip and PC Pin	Rectangular, Angled Fins	1.180" (29.97mm)	0.866" (22.00mm)	-	1.516" (38.50mm)	-	-	-	Aluminum	Black Anodized
HSB16-404018 HEAT SINK, BGA, 40 X 40 X 18 MM Same Sky (Formerly CUI Devices)	1,049	-	Запрос цены	Технический лист	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.575" (40.00mm)	1.575" (40.00mm)	-	0.709" (18.00mm)	9.4W @ 75°C	2.60°C/W @ 200 LFM	7.96°C/W	Aluminum Alloy	Black Anodized
580100B00000G HEATSINK SLIDE-ON 8-DIP Boyd Laconia, LLC	574	-	Запрос цены	Технический лист	-	Bulk	Active	Top Mount	8-DIP	Press Fit, Slide On	Rectangular, Fins	0.562" (14.27mm)	0.600" (15.24mm)	-	0.450" (11.43mm)	1.0W @ 30°C	8.00°C/W @ 500 LFM	30.00°C/W	Aluminum	Black Anodized
HSB40-252510P HEAT SINK, BGA, 25 X 25 X 10 MM, Same Sky (Formerly CUI Devices)	346	-	Запрос цены	Технический лист	HSB	Box	Active	Top Mount	BGA	Push Pin	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.394" (10.00mm)	4.2W @ 75°C	6.00°C/W @ 200 LFM	17.87°C/W	Aluminum Alloy	Black Anodized
576602B00000G HEATSINK TO-220 VERT MNT .95" Boyd Laconia, LLC	3,037	-	Запрос цены	Технический лист	-	Bag	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	0.950" (24.13mm)	1.000" (25.40mm)	-	0.500" (12.70mm)	1.0W @ 20°C	9.00°C/W @ 200 LFM	16.60°C/W	Aluminum	Black Anodized
TGH-0220-03 ALUMINIUM HEAT SINK 22X22MM t-Global Technology	670	-	Запрос цены	Технический лист	TGH	Bulk	Active	Top Mount	-	-	Square, Pin Fins	0.866" (22.00mm)	0.866" (22.00mm)	-	0.354" (9.00mm)	-	-	-	Aluminum	Black Anodized
507222B00000G HEATSINK TO-220 DUAL 10W Boyd Laconia, LLC	339	-	Запрос цены	Технический лист	Hat Section 5070	Bag	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	1.470" (37.34mm)	1.750" (44.45mm)	-	0.375" (9.52mm)	8.0W @ 70°C	3.00°C/W @ 200 LFM	9.60°C/W	Aluminum	Black Anodized
V4330K HEATSINK ANOD ALUM Assmann WSW Components	2,003	-	Запрос цены	Технический лист	-	Bulk	Active	Board Level	KLP	Bolt On	Rectangular, Fins	1.476" (37.50mm)	1.142" (29.00mm)	-	0.472" (12.00mm)	-	-	11.00°C/W	Aluminum	Black Anodized
E2A-T220-38E BLACK ANODIZED HEATSINK Ohmite	144	-	Запрос цены	Технический лист	EX	Bulk	Active	Board Level, Vertical	TO-220	Bolt On and Board Mounts	Rectangular, Fins	0.641" (16.28mm)	0.642" (16.30mm)	-	1.500" (38.10mm)	3.0W @ 50°C	5.00°C/W @ 200 LFM	14.00°C/W	Aluminum	Black Anodized
FA-T220-51E HEATSINK TO-218,TO-220,TO-247 Ohmite	1,499	-	Запрос цены	Технический лист	F	Box	Active	Board Level, Vertical	TO-218, TO-220, TO-247	Bolt On and PC Pin	Rectangular, Fins	2.000" (50.80mm)	1.638" (41.60mm)	-	0.984" (25.00mm)	4.0W @ 20°C	2.00°C/W @ 300 LFM	3.40°C/W	Aluminum	Black Anodized
V8818V HEATSINK ALUM ANOD Assmann WSW Components	488	-	Запрос цены	Технический лист	-	Tray	Active	Board Level	SOT-32, TO-220	Bolt On and PC Pin	Rectangular, Fins	2.362" (60.00mm)	0.748" (19.00mm)	-	0.844" (21.44mm)	-	-	7.50°C/W	Aluminum	Black Anodized
658-25ABT3 HEATSINK CPU 28MM SQ BLK W/TAPE Wakefield-Vette	3,605	-	Запрос цены	Технический лист	658	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	1.100" (27.94mm)	1.100" (27.94mm)	-	0.250" (6.35mm)	2.0W @ 40°C	5.00°C/W @ 500 LFM	-	Aluminum	Black Anodized
HSB17-404025 HEAT SINK, BGA, 40 X 40 X 25 MM Same Sky (Formerly CUI Devices)	596	-	Запрос цены	Технический лист	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.575" (40.00mm)	1.575" (40.00mm)	-	0.984" (25.00mm)	11.7W @ 75°C	2.10°C/W @ 200 LFM	6.41°C/W	Aluminum Alloy	Black Anodized
HSB27-434316 HEAT SINK, BGA, 43.1 X 43.1 X 16 Same Sky (Formerly CUI Devices)	916	-	Запрос цены	Технический лист	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	1.697" (43.10mm)	1.697" (43.10mm)	-	0.650" (16.51mm)	8.98W @ 75°C	2.80°C/W @ 200 LFM	8.35°C/W	Aluminum Alloy	Black Anodized