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| Фото | Номер производителя | Наличие | Количество | Технический лист | Серия | Упаковка | Состояние продукта | Тип | Состав | Диаметр | Точка плавления | Тип флюса | Сечение провода | Тип сетки | Процесс | Форма | Срок хранения | Начало срока годности | Температура хранения/охлаждения |
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26-6040-6411SOLDER FLUX-CORED/331 .062" 5LB |
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Технический лист |
331 | Bulk | Active | Wire Solder | Sn60Pb40 (60/40) | 0.062" (1.57mm) | 361 ~ 374°F (183 ~ 190°C) | Water Soluble | 14 AWG, 16 SWG | - | Leaded | Spool, 5 lbs (2.27kg) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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24-7317-9727SOLDER FLUX-CORED/285 .015" 1LB |
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Технический лист |
285 | Bulk | Active | Wire Solder | Pb88Sn10Ag2 (88/10/2) | 0.015" (0.38mm) | 514 ~ 570°F (268 ~ 299°C) | Rosin Mildly Activated (RMA) | 27 AWG, 28 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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16-6040-0062SOLDER SOLID WIRE .062" 5LB SPL |
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Технический лист |
Solid Core Wire | Bulk | Active | Wire Solder | Sn60Pb40 (60/40) | 0.062" (1.57mm) | 361 ~ 374°F (183 ~ 190°C) | - | 14 AWG, 16 SWG | - | Leaded | Spool, 5 lbs (2.27kg) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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SMDLTLFP500T5CSOLDER PASTE LOW TEMP T5 500G |
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Технический лист |
- | Bulk | Active | Solder Paste | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | - | 281°F (138°C) | No-Clean | - | 5 | Lead Free | Cartridge, 17.64 oz (500g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
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70-5023-2210WP616 SN96.5AG3.0CU0.5 T5 88.3% |
0 |
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Технический лист |
- | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | - | Water Soluble | - | - | Lead Free | Jar, 17.64 oz (500g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
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16-9574-0079SOLDER SOLID WIRE .079" 5LB SPL |
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Технический лист |
Solid Core Wire | Bulk | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.079" (2.01mm) | 441°F (227°C) | - | 12 AWG, 14 SWG | - | Lead Free | Spool, 5 lbs (2.27kg) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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16-6337-0062SOLDER 63/37 14AWG 5LB |
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Технический лист |
Solid Core Wire | Spool | Active | Wire Solder | Sn63Pb37 (63/37) | 0.062" (1.57mm) | 361°F (183°C) | - | 14 AWG, 16 SWG | - | Leaded | Spool, 5 lbs (2.27kg) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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16-9574-0125SOLDER SOLID WIRE .125" 5LB SPL |
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Технический лист |
Solid Core Wire | Bulk | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.125" (3.18mm) | 441°F (227°C) | - | 8 AWG, 10 SWG | - | Lead Free | Spool, 5 lbs (2.27kg) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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70-0102-0411SOLDER PASTE NO CLEAN 600GM |
0 |
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Технический лист |
EP256 | Bulk | Active | Solder Paste | Sn62Pb36Ag2 (62/36/2) | - | 354°F (179°C) | No-Clean | - | 3 | Leaded | Cartridge, 21.16 oz (600g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
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26-6337-8817SOLDER FLUX-CORED/245 63/37.062" |
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Технический лист |
245 | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.062" (1.57mm) | 361°F (183°C) | No-Clean | 14 AWG, 16 SWG | - | Leaded | Spool, 5 lbs (2.27kg) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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SMD291SNL500T5CSOLDER PASTE SAC305 T5 500G |
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Технический лист |
- | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Cartridge, 17.64 oz (500g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
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SMD4300SNL500T5CSOLDER PASTE SAC305 T5 500G |
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Технический лист |
CHIPQUIK® SMD4300 | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | 5 | Lead Free | Cartridge, 17.64 oz (500g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
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25-9574-1400SOLDER FLUX-CORED/48 .062" 4 LB |
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Технический лист |
48 | Bulk | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.062" (1.57mm) | 441°F (227°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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70-4006-2011SOLDER PASTE NO CLEAN 600GM |
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Технический лист |
NP505-HR | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | 5 | Lead Free | Cartridge, 21.16 oz (600g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
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70-0605-0911SOLDER PASTE NO CLEAN 600GM |
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Технический лист |
EM907 | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | 4 | Lead Free | Cartridge, 21.16 oz (600g) | 4 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
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275502CNP NP575-KAP 969 88.8-4-M17 INN |
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Технический лист |
- | Bulk | Active | Solder Paste | - | - | - | No-Clean | - | - | Lead Free | Jar | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
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70-1903-0811SOLDER PASTE WATER SOLUBLE 600GM |
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Технический лист |
R520A | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | - | 3 | Lead Free | Cartridge, 21.16 oz (600g) | 4 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
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25-9574-7634SOLDER FLUX-CORED/275 .093" 4LB |
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Технический лист |
275 | Bulk | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.093" (2.36mm) | 441°F (227°C) | No-Clean | 11 AWG, 13 SWG | - | Lead Free | Spool, 4 lbs (1.81kg) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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70-4105-0919SOLDER PASTE NO CLEAN 750GM |
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Технический лист |
NP545 | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 424°F (217 ~ 218°C) | No-Clean | - | 4 | Lead Free | Cartridge, 24.69 oz (700g) | 12 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
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25-7080-0069SOLDER FLUX-CORED/44 .125" 4LB S |
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Технический лист |
44 | Bulk | Active | Wire Solder | Sn95Sb5 (95/5) | 0.125" (3.18mm) | 450 ~ 464°F (232 ~ 240°C) | Rosin Activated (RA) | 8 AWG, 10 SWG | - | Lead Free | Spool, 4 lbs (1.81kg) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
