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| Фото | Номер производителя | Наличие | Количество | Технический лист | Серия | Упаковка | Состояние продукта | Тип | Состав | Диаметр | Точка плавления | Тип флюса | Сечение провода | Тип сетки | Процесс | Форма | Срок хранения | Начало срока годности | Температура хранения/охлаждения |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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4875-454GSOLDER NO-CLEAN 60/40 1 LB |
0 |
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Технический лист |
4870 | Spool | Obsolete | Wire Solder | Sn60Pb40 (60/40) | 0.032" (0.81mm) | 361 ~ 376°F (183 ~ 191°C) | No-Clean | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | - | - |
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91-7068-7603SOLDER FLUX-CORED/275 .020" 250G |
0 |
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Технический лист |
275 | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.020" (0.51mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 24 AWG, 25 SWG | - | Lead Free | Spool, 8.8 oz (250g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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24-7080-9715SOLDER FLUX-CORED/285 .050 1LB S |
0 |
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Технический лист |
285 | Bulk | Active | Wire Solder | Sn95Sb5 (95/5) | 0.050" (1.27mm) | 450 ~ 464°F (232 ~ 240°C) | Rosin Mildly Activated (RMA) | 16 AWG, 18 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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4860P-250GLEADED NO CLEAN SOLDER PASTE |
0 |
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Технический лист |
4860 | Bulk | Obsolete | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 3 | Leaded | Jar, 8.8 oz (250g) | 24 Months | Date of Manufacture | 39°F ~ 50°F (4°C ~ 10°C) |
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24-7317-9710SOLDER FLUX-CORED/285 .031" 1LB |
0 |
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Технический лист |
285 | Bulk | Active | Wire Solder | Pb88Sn10Ag2 (88/10/2) | 0.031" (0.79mm) | 514 ~ 570°F (268 ~ 299°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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91-7068-7608SOLDER FLUX-CORED/275 .015" 250G |
0 |
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Технический лист |
275 | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015" (0.38mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 27 AWG, 28 SWG | - | Lead Free | Spool, 8.8 oz (250g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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135429663S4 WS200 ACP PASTE 600G SEMCO |
0 |
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Технический лист |
WS200™ | Bulk | Obsolete | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 3 | Leaded | Cartridge, 21.16 oz (600g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) |
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24-7317-9713SOLDER FLUX-CORED/285 .031" 1LB |
0 |
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Технический лист |
285 | Bulk | Active | Wire Solder | Pb88Sn10Ag2 (88/10/2) | 0.031" (0.79mm) | 514 ~ 570°F (268 ~ 299°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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CQ-SS-SNBIAG-0.60MM-25000SOLDER SPHERES SN42/BI57.6/AG0.4 |
0 |
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Технический лист |
- | Bulk | Active | Solder Sphere | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | 0.024" (0.61mm) | 280°F (138°C) | - | - | - | - | Jar | 24 Months | Date of Manufacture | - |
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24-9574-6422SOLDER 66 .015 27AWG 1LB |
0 |
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Технический лист |
331 | Spool | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.015" (0.38mm) | 441°F (227°C) | Water Soluble | 27 AWG, 28 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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91-7068-8853SOLDER FLUX-CORED/245 .015" 250G |
0 |
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Технический лист |
245 | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.015" (0.38mm) | 423 ~ 424°F (217 ~ 218°C) | No-Clean | 27 AWG, 28 SWG | - | Lead Free | Spool, 8.8 oz (250g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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24-7340-0060SOLDER FLUX-CORED/44 .062" 1LB S |
0 |
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Технический лист |
44 | Bulk | Active | Wire Solder | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | 0.062" (1.57mm) | 565 ~ 574°F (296 ~ 301°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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24-7080-0027SOLDER FLUX-CORED/44 .031" 1LB S |
0 |
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Технический лист |
44 | Bulk | Active | Wire Solder | Sn95Sb5 (95/5) | 0.031" (0.79mm) | 450 ~ 464°F (232 ~ 240°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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90-7068-6442SOLDER FLUX-CORED/331 .010" 100G |
0 |
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Технический лист |
331 | Bulk | Active | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 0.010" (0.25mm) | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | 30 AWG, 33 SWG | - | Lead Free | Spool, 3.53 oz (100g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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90-7059-8810SOLDER FLUX-CORED/245 .010 100G |
0 |
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Технический лист |
245 | Bulk | Active | Wire Solder | Sn95.8Ag3.5Cu0.7 (95.8/3.5/0.7) | 0.010" (0.25mm) | - | No-Clean | 30 AWG, 33 SWG | - | Lead Free | Spool, 3.53 oz (100g) | - | - | - |
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24-7150-8802SOLDER FLUX-CORED/245 .031" 1LB |
0 |
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Технический лист |
245 | Bulk | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.031" (0.79mm) | 354°F (179°C) | No-Clean | 20 AWG, 22 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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SMDLTB250T4SOLDER PASTE SN60/BI40 T4 250G J |
0 |
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Технический лист |
CHIPQUIK® | Bulk | Active | Solder Paste | Sn60Bi40 (60/40) | - | 280°F ~ 338°F (138°C ~ 170°C) | No-Clean | - | - | - | Jar, 8.8 oz (250g) | 6 Months | Date of Manufacture | - |
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SSNC-T5-250G63/37 SOLDER PASTE T5 - 250 GRA |
0 |
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Технический лист |
- | Bag | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 5 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
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24-7150-0027SOLDER FLUX-CORED/44 .031" 1LB S |
0 |
|
Технический лист |
44 | Bulk | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.031" (0.79mm) | 354°F (179°C) | Rosin Activated (RA) | 20 AWG, 22 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
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|
24-7080-9713SOLDER FLUX-CORED/285 .031" 1LB |
0 |
|
Технический лист |
285 | Bulk | Active | Wire Solder | Sn95Sb5 (95/5) | 0.031" (0.79mm) | 450 ~ 464°F (232 ~ 240°C) | Rosin Mildly Activated (RMA) | 20 AWG, 22 SWG | - | Lead Free | Spool, 1 lb (454 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) |
