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| Фото | Номер производителя | Наличие | Количество | Технический лист | Серия | Упаковка | Состояние продукта | Тип | Состав | Диаметр | Точка плавления | Тип флюса | Сечение провода | Тип сетки | Процесс | Форма | Срок хранения | Начало срока годности | Температура хранения/охлаждения |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SMD4300SNL10T4SLDR PST WATR SOL SAC305 T4 10CC |
5 |
|
Технический лист |
CHIPQUIK® SMD4300 | Dispenser | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | 4 | Lead Free | Syringe, 1.23 oz (35g), 10cc | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD3SWLT.040 20GSN42/BI58 2.2% FLUX CORE SOLDER |
4 |
|
Технический лист |
SMD3 | Bulk | Active | Wire Solder | Bi58Sn42 (58/42) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | - | Lead Free | Spool, 0.7 oz (20g) | - | - | - |
|
SMDSN100-S-16SOLDER SHOT SN100 16OZ 454G |
4 |
|
Технический лист |
SMD | Bulk | Active | Solder Shot | Sn100(100) | - | 450°F (232°C) | - | - | - | Lead Free | Bag, 1 lb (454g) | - | - | - |
|
NC191SNL50T5SMOOTH FLOW LEAD-FREE SOLDER PAS |
0 |
|
Технический лист |
Smooth Flow™ | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 5 | Lead Free | Jar, 1.76 oz (50g) | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
NC4SW.020 1LBSOLDER WIRE 93.5/5/1.5 LEAD/TIN/ |
3 |
|
Технический лист |
- | Bulk | Active | Wire Solder | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | 0.020" (0.51mm) | 565 ~ 574°F (296 ~ 301°C) | No-Clean | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | - |
|
SMD2SWLF.020 8OZLF SOLDER WIRE 99.3/0.7 TIN/COPP |
4 |
|
Технический лист |
SMD2 | Bulk | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.020" (0.51mm) | 441°F (227°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | - | - | - |
|
WS991AX35T4THERMALLY STABLE SOLDER PASTE WS |
1 |
|
Технический лист |
CHIPQUIK® | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | Water Soluble | - | 4 | - | Syringe, 1.23 oz (34.869g) | 12 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) |
|
TS991AX35T4THERMALLY STABLE SOLDER PASTE NC |
5 |
|
Технический лист |
CHIPQUIK® | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Syringe, 1.23 oz (34.869g) | 12 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) |
|
SMD2SWLF.015 8OZLF SOLDER WIRE 99.3/0.7 TIN/COPP |
4 |
|
Технический лист |
SMD2 | Bulk | Active | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 0.015" (0.38mm) | 441°F (227°C) | No-Clean, Water Soluble | 27 AWG, 28 SWG | - | Lead Free | Spool, 8 oz (227g), 1/2 lb | - | - | - |
|
RASW.031 1LBSOLDER WIRE 63/37 TIN/LEAD ROSIN |
2 |
|
Технический лист |
- | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.031" (0.79mm) | 361°F (183°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | - | Leaded | Spool, 1 lb (454 g) | 60 Months | Date of Manufacture | - |
|
SMDSW.020 1LBSOLDER WIRE 63/37 TIN/LEAD NO-CL |
4 |
|
Технический лист |
- | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020" (0.51mm) | 361°F (183°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | - |
|
RASW.020 1LBSOLDER WIRE 63/37 TIN/LEAD ROSIN |
2 |
|
Технический лист |
- | Bulk | Active | Wire Solder | Sn63Pb37 (63/37) | 0.020" (0.51mm) | 361°F (183°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | - |
|
TS991SNL35T4THERMALLY STABLE SOLDER PASTE NC |
5 |
|
Технический лист |
CHIPQUIK® | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | No-Clean | - | 4 | - | Syringe, 1.23 oz (34.869g) | 12 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) |
|
WBRC63/3762SRA ROSIN FLUX CORE SOLDER, 63/3 |
4 |
|
Технический лист |
- | Spool | Active | Wire Solder | Sn63Pb37 (63/37) | 0.062" (1.57mm) | 361°F (183°C) | Rosin Activated (RA) | 14 AWG, 16 SWG | - | Leaded | Spool, 1 lb (454 g) | - | - | - |
|
WS991SNL35T4THERMALLY STABLE SOLDER PASTE WS |
1 |
|
Технический лист |
CHIPQUIK® | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 423°F (217°C) | Water Soluble | - | 4 | - | Syringe, 1.23 oz (34.869g) | 12 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) |
|
NC191AX250SMOOTH FLOW LEADED SOLDER PASTE |
3 |
|
Технический лист |
Smooth Flow™ | Bulk | Active | Solder Paste | Sn63Pb37 (63/37) | - | 361°F (183°C) | No-Clean | - | 4 | Leaded | Jar, 8.8 oz (250g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
WBRC63/3732SRA ROSIN FLUX CORE SOLDER, 63/3 |
2 |
|
Технический лист |
- | Spool | Active | Wire Solder | Sn63Pb37 (63/37) | 0.032" (0.81mm) | 361°F (183°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | - | Leaded | Spool, 1 lb (454 g) | 24 Months | Date of Manufacture | - |
|
SMD3SW.031 8OZSOLDER WIRE 62/36/2 TIN/LEAD/SIL |
3 |
|
Технический лист |
SMD3 | Bulk | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.031" (0.79mm) | 354°F (179°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | - | - | - |
|
SMD291SNLT6SOLDER PASTE NO CLEAN LEAD-FREE |
0 |
|
Технический лист |
SMD | Bulk | Active | Solder Paste | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | - | 422 ~ 428°F (217 ~ 220°C) | No-Clean | - | 6 | Lead Free | Syringe, 0.53 oz (15g), 5cc | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) |
|
SMD3SW.020 8OZSOLDER WIRE 62/36/2 TIN/LEAD/SIL |
3 |
|
Технический лист |
SMD3 | Bulk | Active | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 0.020" (0.51mm) | 354°F (179°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | - | Leaded | Spool, 8 oz (227g), 1/2 lb | - | - | - |
