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Фото Номер производителя Наличие Цена Количество Технический лист Серия Упаковка Состояние продукта Тип Количество положений или контактов (сетка) Шаг - Сопряжение Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Материал контакта - Сопряжение Тип крепления Особенности Оконечная нагрузка Шаг - Пост Отделка контакта - Пост Толщина отделки контакта - Пост Материал контакта - Пост Материал корпуса Рабочая температура
546-83-296-19-131147

546-83-296-19-131147

CONN SOCKET PGA 296POS GOLD

Preci-Dip

0
546-83-296-19-131147

Технический лист

546 Bulk Active PGA 296 (19 x 19) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
514-83-500M30-001148

514-83-500M30-001148

CONN SOCKET BGA 500POS GOLD

Preci-Dip

0
514-83-500M30-001148

Технический лист

514 Bulk Active BGA 500 (30 x 30) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
558-10-420M26-001104

558-10-420M26-001104

BGA SURFACE MOUNT 1.27MM

Preci-Dip

0
558-10-420M26-001104

Технический лист

558 Bulk Active BGA 420 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Surface Mount Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
84-PRS11010-12

84-PRS11010-12

ZIF 11X11 84PIN FOOTPRN 11010

Aries Electronics

0

-

PRS - Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -
84-PLS10003-12

84-PLS10003-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
84-PLS10003-12

Технический лист

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
84-PRS10003-12

84-PRS10003-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
84-PRS10003-12

Технический лист

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
84-PRS11032-12

84-PRS11032-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
84-PRS11032-12

Технический лист

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
84-PRS12022-12

84-PRS12022-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
84-PRS12022-12

Технический лист

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
84-PRS13053-12

84-PRS13053-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
84-PRS13053-12

Технический лист

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
84-PRS13125-12

84-PRS13125-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
84-PRS13125-12

Технический лист

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
514-83-504M29-001148

514-83-504M29-001148

CONN SOCKET BGA 504POS GOLD

Preci-Dip

0
514-83-504M29-001148

Технический лист

514 Bulk Active BGA 504 (29 x 29) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
518-77-420M26-001105

518-77-420M26-001105

CONN SOCKET PGA 420POS GOLD

Preci-Dip

0
518-77-420M26-001105

Технический лист

518 Bulk Active PGA 420 (26 x 26) 0.050" (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.050" (1.27mm) Gold Flash Brass FR4 Epoxy Glass -55°C ~ 125°C
514-87-652M35-001148

514-87-652M35-001148

CONN SOCKET BGA 652POS GOLD

Preci-Dip

0
514-87-652M35-001148

Технический лист

514 Bulk Active BGA 652 (35 x 35) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
44-3573-16

44-3573-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

0
44-3573-16

Технический лист

57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100" (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled -
550-10-478M26-131152

550-10-478M26-131152

BGA SOLDER TAIL

Preci-Dip

0
550-10-478M26-131152

Технический лист

550 Bulk Active BGA 478 (26 x 26) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Open Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
HLS-1015-T-12

HLS-1015-T-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0
HLS-1015-T-12

Технический лист

HLS Bulk Active SIP 150 (10 x 15) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
550-10-480M29-001152

550-10-480M29-001152

BGA SOLDER TAIL

Preci-Dip

0
550-10-480M29-001152

Технический лист

550 Bulk Active BGA 480 (29 x 29) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
18-PRS17041-12

18-PRS17041-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
18-PRS17041-12

Технический лист

PRS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
56-PRS15057-12

56-PRS15057-12

ZIF PGA SOCKET 56PIN 15X15

Aries Electronics

0

-

PRS - Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -
56-PLS15057-12

56-PLS15057-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

0
56-PLS15057-12

Технический лист

PLS Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
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