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| Фото | Номер производителя | Наличие | Количество | Технический лист | Серия | Упаковка | Состояние продукта | Тип | Количество положений или контактов (сетка) | Шаг - Сопряжение | Отделка контакта - Сопряжение | Толщина отделки контакта - Сопряжение | Материал контакта - Сопряжение | Тип крепления | Особенности | Оконечная нагрузка | Шаг - Пост | Отделка контакта - Пост | Толщина отделки контакта - Пост | Материал контакта - Пост | Материал корпуса | Рабочая температура |
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24-3554-16CONN IC DIP SOCKET ZIF 24POS |
0 |
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Технический лист |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
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614-87-320-19-131144CONN SOCKET PGA 320POS GOLD |
0 |
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Технический лист |
614 | Bulk | Active | PGA | 320 (19 x 19) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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614-87-321-19-121144CONN SOCKET PGA 321POS GOLD |
0 |
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Технический лист |
614 | Bulk | Active | PGA | 321 (19 x 19) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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550-10-456M26-001166BGA PIN ADAPTER 1.27MM SMD |
0 |
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Технический лист |
550 | Bulk | Active | BGA | 456 (26 x 26) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
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APH-1940-G-RAPH-1940-G-R |
0 |
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- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0340-G-RAPH-0340-G-R |
0 |
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- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-1640-G-RAPH-1640-G-R |
0 |
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- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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614-87-325-18-111144CONN SOCKET PGA 325POS GOLD |
0 |
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Технический лист |
614 | Bulk | Active | PGA | 325 (18 x 18) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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546-87-296-19-131147CONN SOCKET PGA 296POS GOLD |
0 |
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Технический лист |
546 | Bulk | Active | PGA | 296 (19 x 19) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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546-83-391-18-101147CONN SOCKET PGA 391POS GOLD |
0 |
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Технический лист |
546 | Bulk | Active | PGA | 391 (18 x 18) | 0.050" (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100" (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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28-6554-16CONN IC DIP SOCKET ZIF 28POS |
0 |
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Технический лист |
55 | Tube | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
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28-6552-16CONN IC DIP SOCKET ZIF 28POS |
0 |
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Технический лист |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
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28-3554-16CONN IC DIP SOCKET ZIF 24POS |
0 |
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Технический лист |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | -55°C ~ 250°C |
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558-10-292M20-001104BGA SURFACE MOUNT 1.27MM |
0 |
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Технический лист |
558 | Bulk | Active | BGA | 292 (20 x 20) | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050" (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
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224-5809-50-06023M TEXTOOL ZIP STRIP SOCKETS 224 |
0 |
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- |
Textool™ | Box | Active | SIP, ZIF (ZIP) | 24 (1 x 24) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 125°C |
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APA-648-G-BADAPTER PLUG |
0 |
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Технический лист |
APA | Bulk | Active | - | 48 (2 x 24) | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | - |
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239-5605-01-0602CONN ZIG-ZAG 39POS GOLD |
0 |
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Технический лист |
- | Bulk | Obsolete | Zig-Zag | 39 (1 x 19, 1 x 20) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | -55°C ~ 150°C |
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232-2601-50-0602IN-LINE ZIP STRIP POCKETS 32 CON |
0 |
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- |
- | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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518-77-292M20-001105CONN SOCKET PGA 292POS GOLD |
0 |
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Технический лист |
518 | Bulk | Active | PGA | 292 (20 x 20) | 0.050" (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050" (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass | -55°C ~ 125°C |
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517-83-685-19-000111CONN SOCKET PGA 685POS GOLD |
0 |
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Технический лист |
517 | Bulk | Active | PGA | 685 (19 x 19) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
