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| Фото | Номер производителя | Наличие | Количество | Технический лист | Серия | Упаковка | Состояние продукта | Тип | Количество положений или контактов (сетка) | Шаг - Сопряжение | Отделка контакта - Сопряжение | Толщина отделки контакта - Сопряжение | Материал контакта - Сопряжение | Тип крепления | Особенности | Оконечная нагрузка | Шаг - Пост | Отделка контакта - Пост | Толщина отделки контакта - Пост | Материал контакта - Пост | Материал корпуса | Рабочая температура |
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110-13-328-61-801000CONN IC SKT DBL |
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110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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APH-1422-G-RAPH-1422-G-R |
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APH-0522-G-RAPH-0522-G-R |
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APH-1022-G-RAPH-1022-G-R |
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APH-1122-G-RAPH-1122-G-R |
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* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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APH-0222-G-RAPH-0222-G-R |
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APH-1222-G-RAPH-1222-G-R |
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APH-0822-G-RAPH-0822-G-R |
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APA-648-G-AADAPTER PLUG |
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Технический лист |
APA | Bulk | Active | - | 48 (2 x 24) | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | - |
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517-83-420-19-111111CONN SOCKET PGA 420POS GOLD |
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Технический лист |
517 | Bulk | Active | PGA | 420 (19 x 19) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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514-87-272M20-001148CONN SOCKET BGA 272POS GOLD |
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Технический лист |
514 | Bulk | Active | BGA | 272 (20 x 20) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
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110-13-628-61-801000CONN IC SKT DBL |
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110 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Solder | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | -55°C ~ 125°C |
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APH-0432-G-TAPH-0432-G-T |
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APH-0532-G-TAPH-0532-G-T |
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APH-1432-G-TAPH-1432-G-T |
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APH-0832-G-TAPH-0832-G-T |
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APH-1232-G-TAPH-1232-G-T |
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APH-0332-G-TAPH-0332-G-T |
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APH-0232-G-TAPH-0232-G-T |
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APH-1632-G-TAPH-1632-G-T |
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