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SLV W 7 092 32 ZTWO ROWS, 0.4 MM; PITCH 1. |
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Технический лист |
SLV W 7 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 32 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLV W 7 092 36 GTWO ROWS, 0.4 MM; PITCH 1. |
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Технический лист |
SLV W 7 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 36 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLV W 8 117 30 ZTWO ROWS, 0.4 MM; PITCH 1. |
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Технический лист |
SLV W 8 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 30 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLV W 8 117 26 ZTWO ROWS, 0.4 MM; PITCH 1. |
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Технический лист |
SLV W 8 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 26 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLV W 6 117 8 ZONE ROW, 0.4 MMFOR INT |
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Технический лист |
SLV W 6 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 8 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLV W 6 117 6 GONE ROW, 0.4 MMFOR INT |
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Технический лист |
SLV W 6 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 6 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLV W 8 092 6 GTWO ROWS, 0.4 MM; PITCH 1. |
0 |
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Технический лист |
SLV W 8 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 6 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLV W 7 092 44 ZTWO ROWS, 0.4 MM; PITCH 1. |
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Технический лист |
SLV W 7 092 | Tube | Active | Header | Male Pin | 0.050" (1.27mm) | 44 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLV W 7 092 68 ZTWO ROWS, 0.4 MM; PITCH 1. |
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Технический лист |
SLV W 7 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 68 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLV W 8 092 32 GTWO ROWS, 0.4 MM; PITCH 1. |
0 |
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Технический лист |
SLV W 8 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 32 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLV W 8 092 54 GTWO ROWS, 0.4 MM; PITCH 1. |
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Технический лист |
SLV W 8 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 54 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLY 1 081 10 G0.5 MM, STRAIGHT |
0 |
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Технический лист |
SLY 1 081 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 10 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.142" (3.60mm) | 0.118" (3.00mm) | 0.319" (8.10mm) | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLV W 4 KA 060 50 ZGRID 1.27 X1.27 MM; SUITABLE FO |
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Технический лист |
SLV W 4 KA 060 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 50 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.098" (2.50mm) | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 1.5A |
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SLV W 6 117 25 ZONE ROW, 0.4 MMFOR INT |
0 |
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Технический лист |
SLV W 6 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 25 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLV W 4 KA 060 48 GGRID 1.27 X1.27 MM; SUITABLE FO |
0 |
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Технический лист |
SLV W 4 KA 060 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 48 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.098" (2.50mm) | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 1.5A |
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SLV W 6 092 28 GONE ROW, 0.4 MMFOR INT |
0 |
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Технический лист |
SLV W 6 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 28 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLV W 6 117 10 GONE ROW, 0.4 MMFOR INT |
0 |
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Технический лист |
SLV W 6 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 10 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLY 1 104 7 Z0.5 MM, STRAIGHT |
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Технический лист |
SLY 1 104 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 7 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.232" (5.90mm) | 0.118" (3.00mm) | 0.409" (10.40mm) | 0.059" (1.50mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLY 11 SMD 133 34 GONE ROW, 0.5 MM, SUITABLE FOR |
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Технический лист |
SLY 11 SMD 133 | Tube | Active | Header | Male Pin | 0.079" (2.00mm) | 34 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.142" (3.60mm) | - | - | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLY 11 SMD 051 30 SONE ROW, 0.5 MM, SUITABLE FOR |
0 |
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Технический лист |
SLY 11 SMD 051 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 30 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.142" (3.60mm) | - | - | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |

