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Разъемы, штыревые контакты

Фото Номер производителя Наличие Цена Количество Технический лист Серия Упаковка Состояние продукта Тип разъема Тип контакта Шаг - Сопряжение Количество положений Количество рядов Расстояние между рядами - Сопряжение Количество загруженных позиций Стиль Защита Тип крепления Оконечная нагрузка Тип крепления Длина контакта - Сопряжение Длина контакта - Пост Общая длина контакта Высота изоляции Форма контакта Отделка контакта - Сопряжение Толщина отделки контакта - Сопряжение Отделка контакта - Пост Материал контакта Материал изоляции Особенности Рабочая температура Номинальный ток (Ампер)
SLV W 7 092 32 Z

SLV W 7 092 32 Z

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0
SLV W 7 092 32 Z

Технический лист

SLV W 7 092 Bulk Active Header Male Pin 0.050" (1.27mm) 32 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLV W 7 092 36 G

SLV W 7 092 36 G

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0
SLV W 7 092 36 G

Технический лист

SLV W 7 092 Bulk Active Header Male Pin 0.050" (1.27mm) 36 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLV W 8 117 30 Z

SLV W 8 117 30 Z

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0
SLV W 8 117 30 Z

Технический лист

SLV W 8 117 Bulk Active Header Male Pin 0.050" (1.27mm) 30 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLV W 8 117 26 Z

SLV W 8 117 26 Z

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0
SLV W 8 117 26 Z

Технический лист

SLV W 8 117 Bulk Active Header Male Pin 0.050" (1.27mm) 26 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLV W 6 117 8 Z

SLV W 6 117 8 Z

ONE ROW, 0.4 MMFOR INT

Fischer Elektronik

0
SLV W 6 117 8 Z

Технический лист

SLV W 6 117 Bulk Active Header Male Pin 0.050" (1.27mm) 8 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLV W 6 117 6 G

SLV W 6 117 6 G

ONE ROW, 0.4 MMFOR INT

Fischer Elektronik

0
SLV W 6 117 6 G

Технический лист

SLV W 6 117 Bulk Active Header Male Pin 0.050" (1.27mm) 6 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLV W 8 092 6 G

SLV W 8 092 6 G

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0
SLV W 8 092 6 G

Технический лист

SLV W 8 092 Bulk Active Header Male Pin 0.050" (1.27mm) 6 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLV W 7 092 44 Z

SLV W 7 092 44 Z

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0
SLV W 7 092 44 Z

Технический лист

SLV W 7 092 Tube Active Header Male Pin 0.050" (1.27mm) 44 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLV W 7 092 68 Z

SLV W 7 092 68 Z

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0
SLV W 7 092 68 Z

Технический лист

SLV W 7 092 Bulk Active Header Male Pin 0.050" (1.27mm) 68 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLV W 8 092 32 G

SLV W 8 092 32 G

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0
SLV W 8 092 32 G

Технический лист

SLV W 8 092 Bulk Active Header Male Pin 0.050" (1.27mm) 32 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLV W 8 092 54 G

SLV W 8 092 54 G

TWO ROWS, 0.4 MM; PITCH 1.

Fischer Elektronik

0
SLV W 8 092 54 G

Технический лист

SLV W 8 092 Bulk Active Header Male Pin 0.050" (1.27mm) 54 2 0.100" (2.54mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLY 1 081 10 G

SLY 1 081 10 G

0.5 MM, STRAIGHT

Fischer Elektronik

0
SLY 1 081 10 G

Технический лист

SLY 1 081 Bulk Active Header Male Pin 0.079" (2.00mm) 10 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.142" (3.60mm) 0.118" (3.00mm) 0.319" (8.10mm) 0.059" (1.50mm) Square Gold 7.87µin (0.200µm) Gold Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SLV W 4 KA 060 50 Z

SLV W 4 KA 060 50 Z

GRID 1.27 X1.27 MM; SUITABLE FO

Fischer Elektronik

0
SLV W 4 KA 060 50 Z

Технический лист

SLV W 4 KA 060 Bulk Active Header Male Pin 0.050" (1.27mm) 50 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.098" (2.50mm) - 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 6 117 25 Z

SLV W 6 117 25 Z

ONE ROW, 0.4 MMFOR INT

Fischer Elektronik

0
SLV W 6 117 25 Z

Технический лист

SLV W 6 117 Bulk Active Header Male Pin 0.050" (1.27mm) 25 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLV W 4 KA 060 48 G

SLV W 4 KA 060 48 G

GRID 1.27 X1.27 MM; SUITABLE FO

Fischer Elektronik

0
SLV W 4 KA 060 48 G

Технический лист

SLV W 4 KA 060 Bulk Active Header Male Pin 0.050" (1.27mm) 48 2 0.050" (1.27mm) All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.236" (6.00mm) 0.098" (2.50mm) - 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 1.5A
SLV W 6 092 28 G

SLV W 6 092 28 G

ONE ROW, 0.4 MMFOR INT

Fischer Elektronik

0
SLV W 6 092 28 G

Технический лист

SLV W 6 092 Bulk Active Header Male Pin 0.050" (1.27mm) 28 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.579" (14.70mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLV W 6 117 10 G

SLV W 6 117 10 G

ONE ROW, 0.4 MMFOR INT

Fischer Elektronik

0
SLV W 6 117 10 G

Технический лист

SLV W 6 117 Bulk Active Header Male Pin 0.050" (1.27mm) 10 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.118" (3.00mm) 0.098" (2.50mm) 0.677" (17.20mm) 0.067" (1.70mm) Square Gold 7.87µin (0.200µm) Gold Copper Zinc Polyamide (PA46), Nylon 4/6, Glass Filled Sandwich -40°C ~ 163°C 1.5A
SLY 1 104 7 Z

SLY 1 104 7 Z

0.5 MM, STRAIGHT

Fischer Elektronik

0
SLY 1 104 7 Z

Технический лист

SLY 1 104 Bulk Active Header Male Pin 0.079" (2.00mm) 7 1 - All Board to Board or Cable Unshrouded Through Hole Solder Push-Pull 0.232" (5.90mm) 0.118" (3.00mm) 0.409" (10.40mm) 0.059" (1.50mm) Square Tin 157.5 ~ 236.2µin (4.00 ~ 6.00µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SLY 11 SMD 133 34 G

SLY 11 SMD 133 34 G

ONE ROW, 0.5 MM, SUITABLE FOR

Fischer Elektronik

0
SLY 11 SMD 133 34 G

Технический лист

SLY 11 SMD 133 Tube Active Header Male Pin 0.079" (2.00mm) 34 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.142" (3.60mm) - - 0.059" (1.50mm) Square Gold 7.87µin (0.200µm) Gold Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A
SLY 11 SMD 051 30 S

SLY 11 SMD 051 30 S

ONE ROW, 0.5 MM, SUITABLE FOR

Fischer Elektronik

0
SLY 11 SMD 051 30 S

Технический лист

SLY 11 SMD 051 Bulk Active Header Male Pin 0.079" (2.00mm) 30 1 - All Board to Board or Cable Unshrouded Surface Mount Solder Push-Pull 0.142" (3.60mm) - - 0.059" (1.50mm) Square Gold 7.87µin (0.200µm) Tin Copper Tin Polyamide (PA46), Nylon 4/6, Glass Filled - -40°C ~ 163°C 3A

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