Доступно 24/7 по
+86 13632816717Разъемы, штыревые контакты
| Фото | Номер производителя | Наличие | Количество | Технический лист | Серия | Упаковка | Состояние продукта | Тип разъема | Тип контакта | Шаг - Сопряжение | Количество положений | Количество рядов | Расстояние между рядами - Сопряжение | Количество загруженных позиций | Стиль | Защита | Тип крепления | Оконечная нагрузка | Тип крепления | Длина контакта - Сопряжение | Длина контакта - Пост | Общая длина контакта | Высота изоляции | Форма контакта | Отделка контакта - Сопряжение | Толщина отделки контакта - Сопряжение | Отделка контакта - Пост | Материал контакта | Материал изоляции | Особенности | Рабочая температура | Номинальный ток (Ампер) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
SLY 9 SMD 055 24 Z B SM0.5 MM |
0 |
|
Технический лист |
SLY 9 SMD 055 | Tube | Active | Header | Male Pin | 0.079" (2.00mm) | 24 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.217" (5.50mm) | 0.130" (3.30mm) | 0.406" (10.30mm) | 0.059" (1.50mm) | Circular | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
|
SL LP 6 SMD 066 16 S PS0.635 MM, LOW PROFILE IN SMD-T |
0 |
|
Технический лист |
SL LP 6 SMD 066 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 16 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
SLY 9 SMD 040 36 Z B SM0.5 MM |
0 |
|
Технический лист |
SLY 9 SMD 040 | Tube | Active | Header | Male Pin | 0.079" (2.00mm) | 36 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.157" (4.00mm) | 0.130" (3.30mm) | 0.346" (8.80mm) | 0.059" (1.50mm) | Circular | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
|
SL LP 6 SMD 066 24 S SM PS0.635 MM, LOW PROFILE IN SMD-T |
0 |
|
Технический лист |
SL LP 6 SMD 066 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 24 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
SLY 9 SMD 055 33 G0.5 MM |
0 |
|
Технический лист |
SLY 9 SMD 055 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 33 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.217" (5.50mm) | 0.130" (3.30mm) | 0.406" (10.30mm) | 0.059" (1.50mm) | Circular | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
|
SLY 9 SMD 040 9 G0.5 MM |
0 |
|
Технический лист |
SLY 9 SMD 040 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 9 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.157" (4.00mm) | 0.130" (3.30mm) | 0.346" (8.80mm) | 0.059" (1.50mm) | Circular | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
|
SL LP 6 SMD 066 28 Z PS0.635 MM, LOW PROFILE IN SMD-T |
0 |
|
Технический лист |
SL LP 6 SMD 066 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 28 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
|
SLV W 7 117 66 GTWO ROWS, 0.4 MM; PITCH 1. |
0 |
|
Технический лист |
SLV W 7 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 66 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
|
|
SLV W 8 117 28 ZTWO ROWS, 0.4 MM; PITCH 1. |
0 |
|
Технический лист |
SLV W 8 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 28 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
|
|
SLV W 7 117 10 GTWO ROWS, 0.4 MM; PITCH 1. |
0 |
|
Технический лист |
SLV W 7 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 10 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
|
|
SLV W 7 092 26 GTWO ROWS, 0.4 MM; PITCH 1. |
0 |
|
Технический лист |
SLV W 7 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 26 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
|
|
SLV W 7 117 48 ZTWO ROWS, 0.4 MM; PITCH 1. |
0 |
|
Технический лист |
SLV W 7 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 48 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
|
|
SLY 1 081 25 G0.5 MM, STRAIGHT |
0 |
|
Технический лист |
SLY 1 081 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 25 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.142" (3.60mm) | 0.118" (3.00mm) | 0.319" (8.10mm) | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
|
SLY 1 081 1 G0.5 MM, STRAIGHT |
0 |
|
Технический лист |
SLY 1 081 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 1 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.142" (3.60mm) | 0.118" (3.00mm) | 0.319" (8.10mm) | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
|
SLV W 6 092 25 GONE ROW, 0.4 MMFOR INT |
0 |
|
Технический лист |
SLV W 6 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 25 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
|
|
SLV W 6 092 32 GONE ROW, 0.4 MMFOR INT |
0 |
|
Технический лист |
SLV W 6 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 32 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
|
|
SLV W 4 KA 060 10 ZGRID 1.27 X1.27 MM; SUITABLE FO |
0 |
|
Технический лист |
SLV W 4 KA 060 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 10 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.098" (2.50mm) | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 1.5A |
|
|
SLV W 4 KA 060 2 GGRID 1.27 X1.27 MM; SUITABLE FO |
0 |
|
Технический лист |
SLV W 4 KA 060 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 2 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.098" (2.50mm) | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 1.5A |
|
|
SLV W 4 KA 060 72 ZGRID 1.27 X1.27 MM; SUITABLE FO |
0 |
|
Технический лист |
SLV W 4 KA 060 | - | Active | Header | Male Pin | 0.050" (1.27mm) | 72 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.098" (2.50mm) | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 1.5A |
|
|
SLY 11 SMD 092 4 ZONE ROW, 0.5 MM, SUITABLE FOR |
0 |
|
Технический лист |
SLY 11 SMD 092 | Tube | Active | Header | Male Pin | 0.079" (2.00mm) | 4 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.142" (3.60mm) | - | - | 0.059" (1.50mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |

