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SL LP 6 SMD 066 46 S B SM0.635 MM, LOW PROFILE IN SMD-T |
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Технический лист |
SL LP 6 SMD 066 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 46 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 7 SMD 030 6 S0.635 MM, LOW PROFILE IN SMD-T |
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Технический лист |
SL LP 7 SMD 030 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 6 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.118" (3.00mm) | 0.130" (3.30mm) | 0.315" (8.00mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 066 70 G B TR PS0.635 MM, LOW PROFILE IN SMD-T |
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Технический лист |
SL LP 6 SMD 066 | Tape & Reel (TR) | Active | Header | Male Pin | 0.100" (2.54mm) | 70 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 7 SMD 055 13 S0.635 MM, LOW PROFILE IN SMD-T |
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Технический лист |
SL LP 7 SMD 055 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 13 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.217" (5.50mm) | 0.150" (3.80mm) | 0.433" (11.00mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 7 SMD 030 15 S0.635 MM, LOW PROFILE IN SMD-T |
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Технический лист |
SL LP 7 SMD 030 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 15 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.118" (3.00mm) | 0.130" (3.30mm) | 0.315" (8.00mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 066 68 S B SM PS0.635 MM, LOW PROFILE IN SMD-T |
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Технический лист |
SL LP 6 SMD 066 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 68 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 066 60 S SM0.635 MM, LOW PROFILE IN SMD-T |
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Технический лист |
SL LP 6 SMD 066 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 60 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLY 9 SMD 040 22 G0.5 MM |
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Технический лист |
SLY 9 SMD 040 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 22 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.157" (4.00mm) | 0.130" (3.30mm) | 0.346" (8.80mm) | 0.059" (1.50mm) | Circular | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 066 30 Z SM0.635 MM, LOW PROFILE IN SMD-T |
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Технический лист |
SL LP 6 SMD 066 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 30 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 066 28 Z B TR0.635 MM, LOW PROFILE IN SMD-T |
0 |
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Технический лист |
SL LP 6 SMD 066 | Tape & Reel (TR) | Active | Header | Male Pin | 0.100" (2.54mm) | 28 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 6 SMD 066 30 G B SM PS0.635 MM, LOW PROFILE IN SMD-T |
0 |
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Технический лист |
SL LP 6 SMD 066 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 30 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLV W 7 117 6 ZTWO ROWS, 0.4 MM; PITCH 1. |
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Технический лист |
SLV W 7 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 6 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLY 1 081 36 S0.5 MM, STRAIGHT |
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Технический лист |
SLY 1 081 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 36 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.142" (3.60mm) | 0.118" (3.00mm) | 0.319" (8.10mm) | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLV W 7 092 6 ZTWO ROWS, 0.4 MM; PITCH 1. |
0 |
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Технический лист |
SLV W 7 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 6 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLY 1 081 26 G0.5 MM, STRAIGHT |
0 |
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Технический лист |
SLY 1 081 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 26 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.142" (3.60mm) | 0.118" (3.00mm) | 0.319" (8.10mm) | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLV W 8 117 24 ZTWO ROWS, 0.4 MM; PITCH 1. |
0 |
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Технический лист |
SLV W 8 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 24 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLV W 7 092 54 ZTWO ROWS, 0.4 MM; PITCH 1. |
0 |
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Технический лист |
SLV W 7 092 | Tube | Active | Header | Male Pin | 0.050" (1.27mm) | 54 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLV W 8 117 56 GTWO ROWS, 0.4 MM; PITCH 1. |
0 |
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Технический лист |
SLV W 8 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 56 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLV W 8 092 28 GTWO ROWS, 0.4 MM; PITCH 1. |
0 |
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Технический лист |
SLV W 8 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 28 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLV W 4 KA 060 40 GGRID 1.27 X1.27 MM; SUITABLE FO |
0 |
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Технический лист |
SLV W 4 KA 060 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 40 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.098" (2.50mm) | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 1.5A |
