Доступно 24/7 по
+86 13632816717Разъемы, штыревые контакты
| Фото | Номер производителя | Наличие | Количество | Технический лист | Серия | Упаковка | Состояние продукта | Тип разъема | Тип контакта | Шаг - Сопряжение | Количество положений | Количество рядов | Расстояние между рядами - Сопряжение | Количество загруженных позиций | Стиль | Защита | Тип крепления | Оконечная нагрузка | Тип крепления | Длина контакта - Сопряжение | Длина контакта - Пост | Общая длина контакта | Высота изоляции | Форма контакта | Отделка контакта - Сопряжение | Толщина отделки контакта - Сопряжение | Отделка контакта - Пост | Материал контакта | Материал изоляции | Особенности | Рабочая температура | Номинальный ток (Ампер) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
SL LP 6 SMD 066 34 G SM0.635 MM, LOW PROFILE IN SMD-T |
0 |
|
Технический лист |
SL LP 6 SMD 066 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 34 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
|
SL LP 7 SMD 040 33 G0.635 MM, LOW PROFILE IN SMD-T |
0 |
|
Технический лист |
SL LP 7 SMD 040 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 33 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.157" (4.00mm) | 0.150" (3.80mm) | 0.374" (9.50mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
|
SL LP 6 SMD 066 32 Z B TR PS0.635 MM, LOW PROFILE IN SMD-T |
0 |
|
Технический лист |
SL LP 6 SMD 066 | Tape & Reel (TR) | Active | Header | Male Pin | 0.100" (2.54mm) | 32 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
|
SL LP 6 SMD 066 62 Z B SM0.635 MM, LOW PROFILE IN SMD-T |
0 |
|
Технический лист |
SL LP 6 SMD 066 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 62 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
|
SL LP 6 SMD 066 6 Z0.635 MM, LOW PROFILE IN SMD-T |
0 |
|
Технический лист |
SL LP 6 SMD 066 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 6 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
|
SL LP 6 SMD 066 24 S SM0.635 MM, LOW PROFILE IN SMD-T |
0 |
|
Технический лист |
SL LP 6 SMD 066 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 24 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
|
SL LP 6 SMD 066 56 Z PS0.635 MM, LOW PROFILE IN SMD-T |
0 |
|
Технический лист |
SL LP 6 SMD 066 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 56 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
|
SL LP 7 SMD 030 12 S0.635 MM, LOW PROFILE IN SMD-T |
0 |
|
Технический лист |
SL LP 7 SMD 030 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 12 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.118" (3.00mm) | 0.130" (3.30mm) | 0.315" (8.00mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
SLY 9 SMD 040 34 Z0.5 MM |
0 |
|
Технический лист |
SLY 9 SMD 040 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 34 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.157" (4.00mm) | 0.130" (3.30mm) | 0.346" (8.80mm) | 0.059" (1.50mm) | Circular | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
|
SLY 9 SMD 055 29 S B SM0.5 MM |
0 |
|
Технический лист |
SLY 9 SMD 055 | Tube | Active | Header | Male Pin | 0.079" (2.00mm) | 29 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.217" (5.50mm) | 0.130" (3.30mm) | 0.406" (10.30mm) | 0.059" (1.50mm) | Circular | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
SLY 9 SMD 055 34 Z B SM0.5 MM |
0 |
|
Технический лист |
SLY 9 SMD 055 | Tube | Active | Header | Male Pin | 0.079" (2.00mm) | 34 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.217" (5.50mm) | 0.130" (3.30mm) | 0.406" (10.30mm) | 0.059" (1.50mm) | Circular | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
|
SL LP 6 SMD 066 20 Z B TR PS0.635 MM, LOW PROFILE IN SMD-T |
0 |
|
Технический лист |
SL LP 6 SMD 066 | Tape & Reel (TR) | Active | Header | Male Pin | 0.100" (2.54mm) | 20 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
|
SLY 9 SMD 040 9 S0.5 MM |
0 |
|
Технический лист |
SLY 9 SMD 040 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 9 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.157" (4.00mm) | 0.130" (3.30mm) | 0.346" (8.80mm) | 0.059" (1.50mm) | Circular | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
|
|
SLV W 8 117 54 ZTWO ROWS, 0.4 MM; PITCH 1. |
0 |
|
Технический лист |
SLV W 8 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 54 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
|
|
SLV W 8 092 12 GTWO ROWS, 0.4 MM; PITCH 1. |
0 |
|
Технический лист |
SLV W 8 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 12 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
|
|
SLV W 7 092 20 ZTWO ROWS, 0.4 MM; PITCH 1. |
0 |
|
Технический лист |
SLV W 7 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 20 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
|
|
SLV W 7 117 42 GTWO ROWS, 0.4 MM; PITCH 1. |
0 |
|
Технический лист |
SLV W 7 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 42 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
|
|
SLV W 7 117 40 GTWO ROWS, 0.4 MM; PITCH 1. |
0 |
|
Технический лист |
SLV W 7 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 40 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
|
|
SLV W 8 092 72 ZTWO ROWS, 0.4 MM; PITCH 1. |
0 |
|
Технический лист |
SLV W 8 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 72 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
|
|
SLV W 7 092 34 GTWO ROWS, 0.4 MM; PITCH 1. |
0 |
|
Технический лист |
SLV W 7 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 34 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |

