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SL LP 6 SMD 066 20 S PS0.635 MM, LOW PROFILE IN SMD-T |
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Технический лист |
SL LP 6 SMD 066 | - | Active | Header | Male Pin | 0.100" (2.54mm) | 20 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.260" (6.60mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 4 069 28 SLOW PROFILE, ANGLED, 0.635 MM |
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Технический лист |
SL LP 4 069 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 28 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.272" (6.90mm) | 0.118" (3.00mm) | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Low Profile | -40°C ~ 163°C | 3A |
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SLV W 7 117 54 ZTWO ROWS, 0.4 MM; PITCH 1. |
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Технический лист |
SLV W 7 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 54 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLY 3 041 15 S0.5 MM, ANGLED |
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Технический лист |
SLY 3 041 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 15 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.161" (4.10mm) | 0.110" (2.80mm) | - | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLV W 7 092 52 ZTWO ROWS, 0.4 MM; PITCH 1. |
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Технический лист |
SLV W 7 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 52 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SLY 3 082 27 Z0.5 MM, ANGLED |
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Технический лист |
SLY 3 082 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 27 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.323" (8.20mm) | 0.110" (2.80mm) | - | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLV W 8 092 56 ZTWO ROWS, 0.4 MM; PITCH 1. |
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Технический лист |
SLV W 8 092 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 56 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SL LP 4 069 54 ZLOW PROFILE, ANGLED, 0.635 MM |
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Технический лист |
SL LP 4 069 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 54 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.272" (6.90mm) | 0.118" (3.00mm) | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Low Profile | -40°C ~ 163°C | 3A |
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SLV W 7 117 16 GTWO ROWS, 0.4 MM; PITCH 1. |
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Технический лист |
SLV W 7 117 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 16 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.677" (17.20mm) | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SL LP 2 139 66 SLOW PROFILE, STRAIGHT, 0.635 M |
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Технический лист |
SL LP 2 139 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 66 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.362" (9.20mm) | 0.118" (3.00mm) | 0.547" (13.90mm) | 0.055" (1.40mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Low Profile | -40°C ~ 163°C | 3A |
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SLV W 4 KA 060 62 ZGRID 1.27 X1.27 MM; SUITABLE FO |
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Технический лист |
SLV W 4 KA 060 | Bulk | Active | Header | Male Pin | 0.050" (1.27mm) | 62 | 2 | 0.050" (1.27mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.236" (6.00mm) | 0.098" (2.50mm) | - | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 1.5A |
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SLV W 6 092 9 ZONE ROW, 0.4 MMFOR INT |
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Технический лист |
SLV W 6 092 | Tube | Active | Header | Male Pin | 0.050" (1.27mm) | 9 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.118" (3.00mm) | 0.098" (2.50mm) | 0.579" (14.70mm) | 0.067" (1.70mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Zinc | Polyamide (PA46), Nylon 4/6, Glass Filled | Sandwich | -40°C ~ 163°C | 1.5A |
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SL LP 2 164 46 ZLOW PROFILE, STRAIGHT, 0.635 M |
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Технический лист |
SL LP 2 164 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 46 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.461" (11.70mm) | 0.118" (3.00mm) | 0.646" (16.40mm) | 0.055" (1.40mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Low Profile | -40°C ~ 163°C | 3A |
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SLY 3 082 13 Z0.5 MM, ANGLED |
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Технический лист |
SLY 3 082 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 13 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.323" (8.20mm) | 0.110" (2.80mm) | - | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLY 11 SMD 092 9 ZONE ROW, 0.5 MM, SUITABLE FOR |
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Технический лист |
SLY 11 SMD 092 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 9 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.142" (3.60mm) | - | - | 0.059" (1.50mm) | Square | Tin | 157.5 ~ 236.2µin (4.00 ~ 6.00µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLY 5 075 15 GONE ROW, 0.5 MM, SUITABLE FOR |
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Технический лист |
SLY 5 075 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 15 | 1 | - | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.142" (3.60mm) | 0.110" (2.80mm) | 0.547" (13.90mm) | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SLY 12 SMD 051 24 STWO ROWS, 0.5 MM, SUITABLE FOR |
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Технический лист |
SLY 12 SMD 051 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 24 | 2 | 0.079" (2.00mm) | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.142" (3.60mm) | - | - | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 2 164 38 GLOW PROFILE, STRAIGHT, 0.635 M |
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Технический лист |
SL LP 2 164 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 38 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole | Solder | Push-Pull | 0.461" (11.70mm) | 0.118" (3.00mm) | 0.646" (16.40mm) | 0.055" (1.40mm) | Square | Gold | 7.87µin (0.200µm) | Gold | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | Low Profile | -40°C ~ 163°C | 3A |
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SLY 11 SMD 133 34 SONE ROW, 0.5 MM, SUITABLE FOR |
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Технический лист |
SLY 11 SMD 133 | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 34 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.142" (3.60mm) | - | - | 0.059" (1.50mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
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SL LP 5 SMD 038 17 S0.635 MM, LOW PROFILE |
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Технический лист |
SL LP 5 SMD 038 | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 17 | 1 | - | All | Board to Board or Cable | Unshrouded | Surface Mount | Solder | Push-Pull | 0.150" (3.80mm) | - | - | 0.067" (1.70mm) | Square | Gold | 7.87µin (0.200µm) | Tin | Copper Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | - | -40°C ~ 163°C | 3A |
