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| Фото | Номер производителя | Наличие | Количество | Технический лист | Серия | Корпус/корпус | Упаковка | Состояние продукта | Применение | Ток - Питание | Напряжение - Питание | Рабочая температура | Марка | Квалификация | Тип крепления | Устройство поставщика Упаковка |
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MC33PF8200DBESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 |
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Технический лист |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200EMESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 |
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Технический лист |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200ETESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 |
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Технический лист |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200A0ESR2POWER MANAGEMENT IC I.MX8 NON-PR |
0 |
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Технический лист |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200DNESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 |
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Технический лист |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200DMESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 |
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Технический лист |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200DFESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 |
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Технический лист |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200DHESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 |
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Технический лист |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200ESESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 |
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Технический лист |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200CXESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 |
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Технический лист |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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UCD9240RGCRIC DGTL PWM SYSTEM CTRLR 64VQFN |
0 |
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Технический лист |
Fusion Digital Power™ | 64-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Special Purpose | - | 3V ~ 3.6V | -40°C ~ 110°C | - | - | Surface Mount | 64-VQFN (9x9) |
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TWL6032A2B6YFFTIC PWR/BATT MGMT 155DSBGA |
0 |
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Технический лист |
- | 155-UFBGA, DSBGA | Tape & Reel (TR) | Discontinued | Handheld/Mobile Devices, OMAP™ | 20µA | 2.5V ~ 4.8V | -40°C ~ 85°C | - | - | Surface Mount | 155-DSBGA (5.21x5.36) |
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MC35FS6512CAER2FS6500 |
0 |
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Технический лист |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC35FS4501CAEFS4500 |
0 |
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Технический лист |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC35FS6501CAEFS6500 |
0 |
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Технический лист |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC34PF8100FJEPPOWER MANAGEMENT IC, I.MX8, PRE- |
0 |
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Технический лист |
- | 56-VFQFN Exposed Pad | Tray | Active | Processor | 10µA | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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LT8253AHUFDM#TRPBF40V USB TYPE-C PD 60W 4-SW BUCK- |
0 |
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Технический лист |
- | 28-WFQFN Exposed Pad | Tape & Reel (TR) | Active | USB, Type-C Controller | 2.1mA | 4V ~ 40V | -40°C ~ 150°C (TJ) | - | - | Surface Mount, Wettable Flank | 28-QFN (4x5) |
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MC35FS6508CAER2SYSTEM BASIS CHIP, DCDC 0.8A VCO |
0 |
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Технический лист |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC34FS6407NAER2SYSTEM BASIS CHIP CAN 5V 0.7 |
0 |
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Технический лист |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | 13mA | 2.7V ~ 36V | -40°C ~ 125°C (TA) | - | - | Surface Mount | 48-HLQFP (7x7) |
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TPS65073RSLRIC PWR MGMT 5CH W/2 LDO 48VQFN |
0 |
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Технический лист |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Mobile/OMAP™ | - | 2.8V ~ 6.3V | -40°C ~ 85°C | - | - | Surface Mount | 48-VQFN (6x6) |
